Electrochemical deposition and mechanical property enhancement of the nickel and nickel-cobalt films

Chen-Kuei Chung, Wei Tse Chang

Research output: Chapter in Book/Report/Conference proceedingChapter

1 Citation (Scopus)

Abstract

Electrochemical deposition is one of the effective and inexpensive processes in surface coating technology. It is of great interest to produce electrochemical deposits with dense structure and good mechanical properties. The electrochemical deposited nickel and nickel-cobalt are the most common materials used in decorative coatings and micro-fabrications. In this chapter, the authors will briefly review characteristics of nickel and nickel-cobalt deposits under different electrochemical treatments and introduce two effective procedures to enhance the strength of deposits: One is to vary the applying potential and the other to alter the temperature of the electrochemical cell. Both experimental and simulation results show that pulse electrodeposition leads to higher concentration of ions at cathodic surface and better penetration ability of ions than that by direct current (DC) one. More compact and hard deposits are formed during pulse electrodeposition compared to DC one. Moreover, usually electrodeposition is difficult to perform at low temperature due to ineffective mass transfer. Through careful control of the output power to the electrochemical cell, the resulting deposit at low temperature presents higher strength than those electrodeposited at relatively high temperatures. The possible mechanism of strengthening and the corresponding electrochemical phenomena are also introduced.

Original languageEnglish
Title of host publicationHandBook of Manufacturing Engineering and Technology
PublisherSpringer-Verlag London Ltd
Pages2891-2927
Number of pages37
ISBN (Electronic)9781447146704
ISBN (Print)9781447146698
DOIs
Publication statusPublished - 2015 Jan 1

Fingerprint

Cobalt
Nickel
Electrodeposition
Mechanical properties
Electrochemical cells
Cobalt deposits
Coatings
Temperature
Microfabrication
Ions
Mass transfer

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Computer Science(all)

Cite this

Chung, C-K., & Chang, W. T. (2015). Electrochemical deposition and mechanical property enhancement of the nickel and nickel-cobalt films. In HandBook of Manufacturing Engineering and Technology (pp. 2891-2927). Springer-Verlag London Ltd. https://doi.org/10.1007/978-1-4471-4670-4_33
Chung, Chen-Kuei ; Chang, Wei Tse. / Electrochemical deposition and mechanical property enhancement of the nickel and nickel-cobalt films. HandBook of Manufacturing Engineering and Technology. Springer-Verlag London Ltd, 2015. pp. 2891-2927
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Chung, C-K & Chang, WT 2015, Electrochemical deposition and mechanical property enhancement of the nickel and nickel-cobalt films. in HandBook of Manufacturing Engineering and Technology. Springer-Verlag London Ltd, pp. 2891-2927. https://doi.org/10.1007/978-1-4471-4670-4_33

Electrochemical deposition and mechanical property enhancement of the nickel and nickel-cobalt films. / Chung, Chen-Kuei; Chang, Wei Tse.

HandBook of Manufacturing Engineering and Technology. Springer-Verlag London Ltd, 2015. p. 2891-2927.

Research output: Chapter in Book/Report/Conference proceedingChapter

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Chung C-K, Chang WT. Electrochemical deposition and mechanical property enhancement of the nickel and nickel-cobalt films. In HandBook of Manufacturing Engineering and Technology. Springer-Verlag London Ltd. 2015. p. 2891-2927 https://doi.org/10.1007/978-1-4471-4670-4_33