The electrochemical properties of the joints formed between Sn-9Zn-1.5Ag-1Bi alloys and Cu substrates in a 3.5 wt.% NaCl solution have been investigated by potentiodynamic polarization, X-ray diffraction, and scanning electron microscopy. For the Sn-9Zn-1.5Ag-1Bi/Cu joints in a 3.5 wt.% NaCl solution, corrosion current (I corr), corrosion potential (E corr) and corrosion resistance (R p) are 2.46 × 10 -6 A/cm 2, -1.18 V, and 7.54 × 10 3Ωcm 2, respectively. Cu 6Sn 5, Cu 5Zn 8, and Ag 3Sn are formed at the interface between the Sn-9Zn-1.5Ag-xBi solder alloy and Cu substrate. The corrosion products of ZnCl 2, SnCl 2 and ZnO are formed at the Sn-9Zn-1.5Ag-xBi/Cu joints after polarization in a 3.5 wt.% NaCl solution. Pits are also formed on the surface of the solder alloys.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry