Electrodeposition Behaviors of Solder Bumps from Fluoroborate & Sulfonate Baths

Kwang Lung Lin, Kun Tzu Hsu

Research output: Contribution to specialist publicationArticle

4 Citations (Scopus)

Abstract

Flip chip solder bumps have been electrodeposited from fluoroborate and sulfonate baths to compare the performance of these two baths with respect to growth behavior, composition and bump height of the eutectic solder bumps on a 4-in. silicon wafer. In general, the fluoroborate bath gives rise to a slower deposition rate than the sulfonate bath, while a slightly better bump uniformity is achieved. The solder bumps exhibit a smooth surface appearance when electrodeposited from a sulfonate bath.

Original languageEnglish
Pages86-89
Number of pages4
Volume87
No.3
Specialist publicationPlating and Surface Finishing
Publication statusPublished - 2000 Mar 1

All Science Journal Classification (ASJC) codes

  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

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