Electrodeposition Behaviors of Solder Bumps from Fluoroborate & Sulfonate Baths

Kwang-Lung Lin, Kun Tzu Hsu

Research output: Contribution to specialist publicationArticle

4 Citations (Scopus)

Abstract

Flip chip solder bumps have been electrodeposited from fluoroborate and sulfonate baths to compare the performance of these two baths with respect to growth behavior, composition and bump height of the eutectic solder bumps on a 4-in. silicon wafer. In general, the fluoroborate bath gives rise to a slower deposition rate than the sulfonate bath, while a slightly better bump uniformity is achieved. The solder bumps exhibit a smooth surface appearance when electrodeposited from a sulfonate bath.

Original languageEnglish
Pages86-89
Number of pages4
Volume87
No.3
Specialist publicationPlating and Surface Finishing
Publication statusPublished - 2000 Mar

Fingerprint

solders
sulfonates
Electrodeposition
electrodeposition
Soldering alloys
baths
Deposition rates
Silicon wafers
Eutectics
eutectics
Chemical analysis
chips
wafers
silicon

All Science Journal Classification (ASJC) codes

  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Cite this

@misc{e9d34082dba74307bd9c050f8c51f064,
title = "Electrodeposition Behaviors of Solder Bumps from Fluoroborate & Sulfonate Baths",
abstract = "Flip chip solder bumps have been electrodeposited from fluoroborate and sulfonate baths to compare the performance of these two baths with respect to growth behavior, composition and bump height of the eutectic solder bumps on a 4-in. silicon wafer. In general, the fluoroborate bath gives rise to a slower deposition rate than the sulfonate bath, while a slightly better bump uniformity is achieved. The solder bumps exhibit a smooth surface appearance when electrodeposited from a sulfonate bath.",
author = "Kwang-Lung Lin and Hsu, {Kun Tzu}",
year = "2000",
month = "3",
language = "English",
volume = "87",
pages = "86--89",
journal = "Plating and Surface Finishing",
issn = "0360-3164",
publisher = "American Electroplaters and Surface Finishers Soc. Inc.",

}

Electrodeposition Behaviors of Solder Bumps from Fluoroborate & Sulfonate Baths. / Lin, Kwang-Lung; Hsu, Kun Tzu.

In: Plating and Surface Finishing, Vol. 87, No. 3, 03.2000, p. 86-89.

Research output: Contribution to specialist publicationArticle

TY - GEN

T1 - Electrodeposition Behaviors of Solder Bumps from Fluoroborate & Sulfonate Baths

AU - Lin, Kwang-Lung

AU - Hsu, Kun Tzu

PY - 2000/3

Y1 - 2000/3

N2 - Flip chip solder bumps have been electrodeposited from fluoroborate and sulfonate baths to compare the performance of these two baths with respect to growth behavior, composition and bump height of the eutectic solder bumps on a 4-in. silicon wafer. In general, the fluoroborate bath gives rise to a slower deposition rate than the sulfonate bath, while a slightly better bump uniformity is achieved. The solder bumps exhibit a smooth surface appearance when electrodeposited from a sulfonate bath.

AB - Flip chip solder bumps have been electrodeposited from fluoroborate and sulfonate baths to compare the performance of these two baths with respect to growth behavior, composition and bump height of the eutectic solder bumps on a 4-in. silicon wafer. In general, the fluoroborate bath gives rise to a slower deposition rate than the sulfonate bath, while a slightly better bump uniformity is achieved. The solder bumps exhibit a smooth surface appearance when electrodeposited from a sulfonate bath.

UR - http://www.scopus.com/inward/record.url?scp=0041908217&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0041908217&partnerID=8YFLogxK

M3 - Article

VL - 87

SP - 86

EP - 89

JO - Plating and Surface Finishing

JF - Plating and Surface Finishing

SN - 0360-3164

ER -