Electrodeposition of eutectic Sn-Zn alloy by pulse plating

Kwang Lung Lin, Li Min Sun

Research output: Contribution to journalArticlepeer-review

16 Citations (Scopus)


A uniform deposition of a Sn-Zn alloy deposit was achieved by pulse plating. Apparently, the relative composition of Sn and Zn in the deposit was affected by the bath compositions and pulse condition. A pulse-plating condition of 99.9 ms on-time and 1.0 ms off-time gave rise to a eutectic Sn-Zn deposit, with a eutectic temperature of 198.8 °C (as analyzed by differential scanning calorimetry) and a uniform composition distribution across the deposit. A mechanism for explaining the pulse-deposition behavior of the Sn-Zn eutectic deposit was proposed. A longer off-time period, 99.9 ms versus 0.1 ms, resulted in a nodular, yet thinner deposit.

Original languageEnglish
Pages (from-to)2203-2207
Number of pages5
JournalJournal of Materials Research
Issue number9
Publication statusPublished - 2003 Sep

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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