Electromigration design rules for bidirectional current

Jiang Tao, Jone F. Chen, Nathan W. Cheung, Chenming Hu

Research output: Contribution to journalConference articlepeer-review

13 Citations (Scopus)

Abstract

Electromigration reliability of different metallization systems and structures under bidirectional current stress is studied in a wide frequency range (from mHz to 200 MHz). The experimental results show that at very low frequencies, the damage healing factor and lifetime under AC stress increases with increasing frequency. At high frequencies, the pure AC lifetime was found to be determined by the thermal migration instead of electromigration. All the observations are in agreement with an average current model indicating that while AC current contributes to self-heating, only the average (DC) current contributes to electromigration in all practical cases for interconnects and vias. The conclusion applies to all materials and geometries tested.

Original languageEnglish
Pages (from-to)180-187
Number of pages8
JournalAnnual Proceedings - Reliability Physics (Symposium)
Publication statusPublished - 1996 Jan 1
EventProceedings of the 1996 34th Annual IEEE International Reliability Physics - Dallas, TX, USA
Duration: 1996 Apr 301996 May 2

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

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