Electromigration effect upon single- and two-phase Ag-Cu alloy strips: An in situ study

Yu chen Liu, Yung si Yu, Shih kang Lin, Shang Jui Chiu

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

Electromigration (EM) is a major failure mode in electronic interconnections, which is commonly made of Ag, Cu, and their alloys. Herein, a single- and two-phase Ag[sbnd]Cu alloys were subjected with current density of 4 × 105 A/cm2 for in situ microstructural and crystallographic characterizations. Anomalous grain growth and the formation of cord-like grains with an aspect ratio over 1000 and asymmetrical hillock/voids clusters were found. These abnormal morphological evolutions were resulted from the electron flow-induced lattice strains, which was inversely correlated with the lifespan of interconnection. Multi-phase alloys are less resistant to EM due to the unbalanced electron flow-induced strains.

Original languageEnglish
Pages (from-to)134-138
Number of pages5
JournalScripta Materialia
Volume173
DOIs
Publication statusPublished - 2019 Dec

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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