Electromigration-induced void formation at the Cu 5Zn 8/solder interface in a Cu/Sn-9Zn/Cu sandwich

Shih Ming Kuo, Kwang Lung Lin

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)

Abstract

The electromigration that occurs in a Cu/Sn-9Zn/Cu sandwich was investigated for void formation at room temperature with 10 3 A/cm 2. A focused ion beam revealed that voids nucleated at the intermetallic compound (IMC)/solder interface regardless of the electron flow direction. The needle-like voids initiated at the cathode Cu 5Zn 8/solder interface due to the outward diffusion of Zn atoms in the Zn-rich phase and expanded as a result of the surface diffusion of Sn atoms upon current stressing.

Original languageEnglish
Pages (from-to)1611-1617
Number of pages7
JournalJournal of Electronic Materials
Volume37
Issue number10
DOIs
Publication statusPublished - 2008 Oct 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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