Abstract
The electromigration that occurs in a Cu/Sn-9Zn/Cu sandwich was investigated for void formation at room temperature with 10 3 A/cm 2. A focused ion beam revealed that voids nucleated at the intermetallic compound (IMC)/solder interface regardless of the electron flow direction. The needle-like voids initiated at the cathode Cu 5Zn 8/solder interface due to the outward diffusion of Zn atoms in the Zn-rich phase and expanded as a result of the surface diffusion of Sn atoms upon current stressing.
Original language | English |
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Pages (from-to) | 1611-1617 |
Number of pages | 7 |
Journal | Journal of Electronic Materials |
Volume | 37 |
Issue number | 10 |
DOIs | |
Publication status | Published - 2008 Oct 1 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry