The electromigration that occurs in a Cu/Sn-9Zn/Cu sandwich was investigated for void formation at room temperature with 10 3 A/cm 2. A focused ion beam revealed that voids nucleated at the intermetallic compound (IMC)/solder interface regardless of the electron flow direction. The needle-like voids initiated at the cathode Cu 5Zn 8/solder interface due to the outward diffusion of Zn atoms in the Zn-rich phase and expanded as a result of the surface diffusion of Sn atoms upon current stressing.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry