Electromigration-induced void formation at the Cu 5Zn 8/solder interface in a Cu/Sn-9Zn/Cu sandwich

Shih Ming Kuo; Kwang Lung Lin

doi:10.1007/s11664-008-0512-6

Electromigration-induced void formation at the Cu ₅Zn ₈/solder interface in a Cu/Sn-9Zn/Cu sandwich

Shih Ming Kuo, Kwang Lung Lin

Research output: Contribution to journal › Article › peer-review

11 Citations (Scopus)

Abstract

The electromigration that occurs in a Cu/Sn-9Zn/Cu sandwich was investigated for void formation at room temperature with 10 ³ A/cm ². A focused ion beam revealed that voids nucleated at the intermetallic compound (IMC)/solder interface regardless of the electron flow direction. The needle-like voids initiated at the cathode Cu ₅Zn ₈/solder interface due to the outward diffusion of Zn atoms in the Zn-rich phase and expanded as a result of the surface diffusion of Sn atoms upon current stressing.

Original language	English
Pages (from-to)	1611-1617
Number of pages	7
Journal	Journal of Electronic Materials
Volume	37
Issue number	10
DOIs	https://doi.org/10.1007/s11664-008-0512-6
Publication status	Published - 2008 Oct

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/s11664-008-0512-6

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title = "Electromigration-induced void formation at the Cu 5Zn 8/solder interface in a Cu/Sn-9Zn/Cu sandwich",

abstract = "The electromigration that occurs in a Cu/Sn-9Zn/Cu sandwich was investigated for void formation at room temperature with 10 3 A/cm 2. A focused ion beam revealed that voids nucleated at the intermetallic compound (IMC)/solder interface regardless of the electron flow direction. The needle-like voids initiated at the cathode Cu 5Zn 8/solder interface due to the outward diffusion of Zn atoms in the Zn-rich phase and expanded as a result of the surface diffusion of Sn atoms upon current stressing.",

author = "Kuo, {Shih Ming} and Lin, {Kwang Lung}",

note = "Funding Information: The support of this study by the National Science Council of the Republic of China under Grant NSC94-2216-E-006-014 is gratefully acknowledged.",

year = "2008",

month = oct,

doi = "10.1007/s11664-008-0512-6",

language = "English",

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journal = "Journal of Electronic Materials",

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T1 - Electromigration-induced void formation at the Cu 5Zn 8/solder interface in a Cu/Sn-9Zn/Cu sandwich

AU - Kuo, Shih Ming

AU - Lin, Kwang Lung

N1 - Funding Information: The support of this study by the National Science Council of the Republic of China under Grant NSC94-2216-E-006-014 is gratefully acknowledged.

PY - 2008/10

Y1 - 2008/10

N2 - The electromigration that occurs in a Cu/Sn-9Zn/Cu sandwich was investigated for void formation at room temperature with 10 3 A/cm 2. A focused ion beam revealed that voids nucleated at the intermetallic compound (IMC)/solder interface regardless of the electron flow direction. The needle-like voids initiated at the cathode Cu 5Zn 8/solder interface due to the outward diffusion of Zn atoms in the Zn-rich phase and expanded as a result of the surface diffusion of Sn atoms upon current stressing.

AB - The electromigration that occurs in a Cu/Sn-9Zn/Cu sandwich was investigated for void formation at room temperature with 10 3 A/cm 2. A focused ion beam revealed that voids nucleated at the intermetallic compound (IMC)/solder interface regardless of the electron flow direction. The needle-like voids initiated at the cathode Cu 5Zn 8/solder interface due to the outward diffusion of Zn atoms in the Zn-rich phase and expanded as a result of the surface diffusion of Sn atoms upon current stressing.

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Electromigration-induced void formation at the Cu ₅Zn ₈/solder interface in a Cu/Sn-9Zn/Cu sandwich

Abstract

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