Electroporation microchips for continuous gene transfection

Yu Cheng Lin, Chung Min Jen, Ming Yuan Huang, Ching Yi Wu, Xi Zhang Lin

Research output: Contribution to journalArticlepeer-review

100 Citations (Scopus)


Electroporation is a technique with which DNA molecules can be delivered into cells in a chamber using high electric field pulses. Compared to the commercial equipment, the fabricated flow-type electroporation microchip overcomes the limit in the amount of target cells and the potential risk of using high voltage, which are the two drawbacks in current electroporation technology. The flowing mechanism eliminates the temperature-rising effect found in a commercial sterile plastic cuvette during electroporation and thus can improve the survival rate of cells after electroporation. The electroporation microchip, consisting of a micro-channel with gold thin film electrodes on both sides, was fabricated on PMMA material using evaporation, photolithography, lift-off and fusion-bonding methods. The suspension fluid of Huh-7 cell lines mixed with reporter genes flowed through the channel under a series of electrical square pulses. Trypan blue staining was used to assess the viability of the cells treated with pu lses. The cells were evaluated under a microscope. The dimensions of the channel were 5mm wide, 0.2mm high and 25mm long. Cell experiments demonstrated that our microchip could transfect the flowing cells with the expression of reporter genes with lower dissipated heat. The survival rate increased with a lower pulse frequency and a higher flow speed. Our newly designed novel microchip for electroporation of continuous cell flow will have great potential for future gene delivery in hematologic malignancy.

Original languageEnglish
Pages (from-to)137-143
Number of pages7
JournalSensors and Actuators, B: Chemical
Issue number2-3
Publication statusPublished - 2001 Oct 15

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering
  • Materials Chemistry


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