Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint

Wei Yu Chen, Tsung Chieh Chiu, Kwang Lung Lin, Yi Shao Lai

Research output: Contribution to journalArticle

23 Citations (Scopus)

Abstract

The electrorecrystallization, recrystallization driven by electrical current stressing, of Cu 6Sn 5 intermetallic compound occurs in a Sn0.7Cu flip chip solder bump. The Cu 6Sn 5 dissolves in Sn0.7Cu at 1.0 × 10 4 A/cm 2 of current stressing under 150°C. The Cu flux in the solder joint, driven by the combination force of thermal gradient and electromigration, flows toward the cold side of the solder joint. The segregation of Cu results in recrystallization and thus redistribution of IMC at the cold side of the solder joint after current stops.

Original languageEnglish
Pages (from-to)40-43
Number of pages4
JournalIntermetallics
Volume26
DOIs
Publication statusPublished - 2012 Jul 1

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

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