Electrothermal coupling analysis and experimental verification for wirebond devices

Chin Li Kao, Tei-Chen Chen

Research output: Contribution to journalArticle

Abstract

The thermal performance of a powered wirebond device with package level and board level test specimens was investigated by both analytical and experiment methods. The effects of thickness and thermal conductivity of the molding compound and heat spreader attached to the top surface of the molding compound on the performance of the Au wire and silicon die were modeled and evaluated by three-dimensional electrothermal coupling analysis. An advanced quad flat no-lead (QFN) sample was selected to experimentally measure the maximum allowable current in Au wire for packages either with or without molding compound. Two failure modes, namely the fusing of the wire and the decomposition temperature of the molding compound, were established in analysis. A board level test specimen with a thermal test die was also employed to measure the real time package thermal performance. The major achievement of this work is in the complete combination of modeling, experiment, and optimization for thermal performance evaluation purpose of a powered wirebond device. Results of this physical analysis can provide a reliable and useful guide to estimate the maximum allowable currents in Au wires for a wirebond device under practical application conditions.

Original languageEnglish
Pages (from-to)268-279
Number of pages12
JournalTransactions of the Canadian Society for Mechanical Engineering
Volume42
Issue number3
DOIs
Publication statusPublished - 2018 Jan 1

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

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