Enabling high aspect ratio nano-hole metal filling by employing supercritical carbon dioxide electrochemical deposition

Wen Ta Tsai, Jun Jie Yang, Chi Lin Cheng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationProceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016
PublisherAvestia Publishing
ISBN (Print)9781927877197
DOIs
Publication statusPublished - 2016 Jan 1
EventProceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016 - Prague, Czech Republic
Duration: 2016 Apr 12016 Apr 2

Publication series

NameWorld Congress on Recent Advances in Nanotechnology
ISSN (Electronic)2371-5308

Other

OtherProceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016
CountryCzech Republic
CityPrague
Period16-04-0116-04-02

Fingerprint

Carbon Dioxide
Aspect Ratio
Aspect ratio
Carbon dioxide
carbon dioxide
Metals
metal

All Science Journal Classification (ASJC) codes

  • Biotechnology
  • Biomedical Engineering
  • Mechanical Engineering
  • Management, Monitoring, Policy and Law
  • Pollution
  • Biomaterials
  • Modelling and Simulation
  • Histology

Cite this

Tsai, W. T., Yang, J. J., & Cheng, C. L. (2016). Enabling high aspect ratio nano-hole metal filling by employing supercritical carbon dioxide electrochemical deposition. In Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016 (World Congress on Recent Advances in Nanotechnology). Avestia Publishing. https://doi.org/10.11159/icnnfc16.119
Tsai, Wen Ta ; Yang, Jun Jie ; Cheng, Chi Lin. / Enabling high aspect ratio nano-hole metal filling by employing supercritical carbon dioxide electrochemical deposition. Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016. Avestia Publishing, 2016. (World Congress on Recent Advances in Nanotechnology).
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Tsai, WT, Yang, JJ & Cheng, CL 2016, Enabling high aspect ratio nano-hole metal filling by employing supercritical carbon dioxide electrochemical deposition. in Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016. World Congress on Recent Advances in Nanotechnology, Avestia Publishing, Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016, Prague, Czech Republic, 16-04-01. https://doi.org/10.11159/icnnfc16.119

Enabling high aspect ratio nano-hole metal filling by employing supercritical carbon dioxide electrochemical deposition. / Tsai, Wen Ta; Yang, Jun Jie; Cheng, Chi Lin.

Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016. Avestia Publishing, 2016. (World Congress on Recent Advances in Nanotechnology).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Tsai WT, Yang JJ, Cheng CL. Enabling high aspect ratio nano-hole metal filling by employing supercritical carbon dioxide electrochemical deposition. In Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016. Avestia Publishing. 2016. (World Congress on Recent Advances in Nanotechnology). https://doi.org/10.11159/icnnfc16.119