Endochronic simulation for thermal viscoplastic and creep deformation

Kuo Long Lee, Hao Yuan Chang, Wen-Fung Pan

Research output: Contribution to journalArticle

Abstract

In this study, the rate-sensitivity function of the intrinsic time measure of the endochronic theory, which was proposed by Pan and Chern (1997), is reformulated so that it can be used to simulate thermal viscoplastic deformation. By using the scaling function of the intrinsic time scale of the endochronic theory, which was proposed by Pan et al. (1999), the thermal creep deformation of material can also be described. Experimental data of 40Pb/60Sn solder alloy subjected to pure tensile, creep and cyclic tension-compression tests for several temperature ranges and strain-rates, which were conducted by Sasaki et al. (2001), were used to compare with the endochronic simulation. Good agreement between the experimental result and the endochronic approach has been achieved.

Original languageEnglish
Pages (from-to)65-73
Number of pages9
JournalJournal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an
Volume32
Issue number1
DOIs
Publication statusPublished - 2009 Jan 1

Fingerprint

Creep
Soldering alloys
Strain rate
Temperature
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

@article{17a450b1f28143428e996c80dc1aa1a8,
title = "Endochronic simulation for thermal viscoplastic and creep deformation",
abstract = "In this study, the rate-sensitivity function of the intrinsic time measure of the endochronic theory, which was proposed by Pan and Chern (1997), is reformulated so that it can be used to simulate thermal viscoplastic deformation. By using the scaling function of the intrinsic time scale of the endochronic theory, which was proposed by Pan et al. (1999), the thermal creep deformation of material can also be described. Experimental data of 40Pb/60Sn solder alloy subjected to pure tensile, creep and cyclic tension-compression tests for several temperature ranges and strain-rates, which were conducted by Sasaki et al. (2001), were used to compare with the endochronic simulation. Good agreement between the experimental result and the endochronic approach has been achieved.",
author = "Lee, {Kuo Long} and Chang, {Hao Yuan} and Wen-Fung Pan",
year = "2009",
month = "1",
day = "1",
doi = "10.1080/02533839.2009.9671483",
language = "English",
volume = "32",
pages = "65--73",
journal = "Chung-kuo Kung Ch'eng Hsueh K'an/Journal of the Chinese Institute of Engineers",
issn = "0253-3839",
publisher = "Chinese Institute of Engineers",
number = "1",

}

TY - JOUR

T1 - Endochronic simulation for thermal viscoplastic and creep deformation

AU - Lee, Kuo Long

AU - Chang, Hao Yuan

AU - Pan, Wen-Fung

PY - 2009/1/1

Y1 - 2009/1/1

N2 - In this study, the rate-sensitivity function of the intrinsic time measure of the endochronic theory, which was proposed by Pan and Chern (1997), is reformulated so that it can be used to simulate thermal viscoplastic deformation. By using the scaling function of the intrinsic time scale of the endochronic theory, which was proposed by Pan et al. (1999), the thermal creep deformation of material can also be described. Experimental data of 40Pb/60Sn solder alloy subjected to pure tensile, creep and cyclic tension-compression tests for several temperature ranges and strain-rates, which were conducted by Sasaki et al. (2001), were used to compare with the endochronic simulation. Good agreement between the experimental result and the endochronic approach has been achieved.

AB - In this study, the rate-sensitivity function of the intrinsic time measure of the endochronic theory, which was proposed by Pan and Chern (1997), is reformulated so that it can be used to simulate thermal viscoplastic deformation. By using the scaling function of the intrinsic time scale of the endochronic theory, which was proposed by Pan et al. (1999), the thermal creep deformation of material can also be described. Experimental data of 40Pb/60Sn solder alloy subjected to pure tensile, creep and cyclic tension-compression tests for several temperature ranges and strain-rates, which were conducted by Sasaki et al. (2001), were used to compare with the endochronic simulation. Good agreement between the experimental result and the endochronic approach has been achieved.

UR - http://www.scopus.com/inward/record.url?scp=59049083753&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=59049083753&partnerID=8YFLogxK

U2 - 10.1080/02533839.2009.9671483

DO - 10.1080/02533839.2009.9671483

M3 - Article

VL - 32

SP - 65

EP - 73

JO - Chung-kuo Kung Ch'eng Hsueh K'an/Journal of the Chinese Institute of Engineers

JF - Chung-kuo Kung Ch'eng Hsueh K'an/Journal of the Chinese Institute of Engineers

SN - 0253-3839

IS - 1

ER -