Endurance of NiCuZn ferrite chip inductors

Cheng Su Chiang, Ying Lai Chai, Shih Feng Chien, Wen Hsi Lee

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Plating conditions significantly affect the reliability of components. Matter exchanges between the surface of components and the plating solution often occur during plating process owing to the corrosive characteristics of the latter, and this will lead to the production of excess ions and electrons and, subsequently, to electromigration. Reducing the plating current and shortening the plating time can inhibit the corrosion associated with the plating solution, and thus lengthen the life of components. Another approach is to increase sintering temperature, which can enhance the resistance of the surfaces of components to the plating solution, and thus also increase their lifespan. With regard to the cause of electromigration, the electric field might arise from the interaction between the magnetic field and the joule heat generated by the current load and ambient temperature during the test of the component lifespan.

Original languageEnglish
Article number123001
JournalJapanese Journal of Applied Physics
Volume54
Issue number12
DOIs
Publication statusPublished - 2015 Dec

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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