TY - JOUR
T1 - Enhanced Thermal Stability in SiO2/Carbon Filler Derived from Rice Husk via Microwave Treatment for Electronic Packaging Application
AU - Hsieh, Ya Yu
AU - Huang, Chin Zen
AU - Tsai, Yun Chih
AU - Lin, Hong Ping
AU - Hsu, Chun Han
AU - Loganathan, Aswaghosh
PY - 2017/9
Y1 - 2017/9
N2 - Here we report the effect of microwave treatment on a silica–carbon (SiO2 /C) filler derived from rice husk and the function of the microwave-treated filler in an epoxy matrix for electronic packaging applications. Thermogravimetric analysis revealed improved thermal stability of the SiO2 /C filler upon microwave treatment. X-ray diffraction analysis indicated partial SiC formation after the microwave treatment. For packaging applications, compared to that of the pure epoxy polymer, the thermal conductivity of the epoxy–SiO2 /C composite was improved by 178% at 40 wt % content of the microwave-treated SiO2 /C filler. Furthermore, an improvement of 149% in storage modulus and 17.6°C in glass transition temperature of the epoxy–SiO2 /C composites was realized. The improvement in thermal stability of SiO2 /C filler could be achieved via a simple microwave treatment, which in turn enhanced the thermal stability, thermal conduction, and thermomechanical strength of the electronic packaging materials.
AB - Here we report the effect of microwave treatment on a silica–carbon (SiO2 /C) filler derived from rice husk and the function of the microwave-treated filler in an epoxy matrix for electronic packaging applications. Thermogravimetric analysis revealed improved thermal stability of the SiO2 /C filler upon microwave treatment. X-ray diffraction analysis indicated partial SiC formation after the microwave treatment. For packaging applications, compared to that of the pure epoxy polymer, the thermal conductivity of the epoxy–SiO2 /C composite was improved by 178% at 40 wt % content of the microwave-treated SiO2 /C filler. Furthermore, an improvement of 149% in storage modulus and 17.6°C in glass transition temperature of the epoxy–SiO2 /C composites was realized. The improvement in thermal stability of SiO2 /C filler could be achieved via a simple microwave treatment, which in turn enhanced the thermal stability, thermal conduction, and thermomechanical strength of the electronic packaging materials.
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U2 - 10.1002/jccs.201700131
DO - 10.1002/jccs.201700131
M3 - Article
AN - SCOPUS:85029613120
VL - 64
SP - 1035
EP - 1040
JO - Journal of the Chinese Chemical Society
JF - Journal of the Chinese Chemical Society
SN - 0009-4536
IS - 9
ER -