Enhancement of Effective Barrier Height in Ti-Silicon Schottky Diode Using Low-Energy Ion Implantation

Increasing the effective barrier height in a Ti-p-type silicon Schottky diode has been achieved by means of low-energy ion implantation to introduce a thin inversion layer on silicon substrate. It is shown theoretically that effective barrier height equal to the energy bandgap can be obtained in such structure if the thickness and dopant density of the implanted layer are properly chosen. Experimental results for several titanium (Ti) on phosphorus implanted p-type silicon Schottky diodes show that effective barrier heights were increased from 0.6 eV for the Ti-p Si Schottky diode to 0.96 eV for a Ti-n-p-Si Schottky diode with a phosphorus-implanted layer thickness of 400 Å and dose of 1.26 × 1012 cm−2. Good agreement is obtained between the calculated and the measured barrier height for several Ti-n-p silicon Schottky diodes.