Abstract
The epitaxial growth of an epi-Ge layer via GexSi1-xO2 reduction in hydrogen annealing is reported. GexSi+1-x alloys with x = 0.52 and 0.82 were first grown epitaxially on Si substrates. They were then oxidized in a wet ambient and subsequently annealed in 5% or 100% H2. The reduction of Ge from its oxide state is observed in both samples with both ambients. However, an epitaxial Ge growth is only observed in the sample with x = 0.82 after the 5% H2 annealing. The other three cases result in the formation of polycrystalline Ge. The roles of the hydrogen partial pressure and the Ge content are discussed and conditions under which this novel mode of solid-phase epitaxy can occur are explained.
| Original language | English |
|---|---|
| Pages (from-to) | 437-440 |
| Number of pages | 4 |
| Journal | Journal of Electronic Materials |
| Volume | 23 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - 1994 May |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry