| Original language | English |
|---|---|
| Title of host publication | The 27th International Conference on Flexible Automation and Intelligent Manufacturing (FAIM2017) |
| Place of Publication | Modena, Italy |
| Publication status | Published - 2017 |
Equipment Health Monitoring in the Semiconductor Assembly Process.
Dong Zhao-Hong, Jang Bo-Kai, Chia-Yen Lee
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution