Escape from the destruction of the galvanic replacement reaction for solid → hollow → solid conversion process in one pot reaction

Yi Hsin Chien, Ming Fong Tsai, Vijayakumar Shanmugam, Kripasindhu Sardar, Cheng Liang Huang, Chen-Sheng Yeh

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

Based on the difference in the redox potentials between two metal species, the galvanic replacement reaction is known to create an irreversible process to generate hollow nanostructures in a wide range of shapes. In the context of galvanic replacement reaction, continuing etching leads to the general collapse of the hollow structures because of the excess amount of oxidizing agent. We demonstrate the growth of solid nanostructures from a hollow frame-like architecture in the course of a galvanic replacement reaction without any morphology destruction. We report the successful composition transformation of solid Ag with a wide range of shapes, such as plate, decahedron, rod, prism, sphere, and foil, from as thin as <10 nm up to 5 μm and with an area of ∼4 mm2, to their solid Au counterparts using straightforward chemical reactions. The successful conversion process relies on a decrease in the reduction rate of the metallic precursor to initiate dissolution of Ag in the first stage (a galvanic replacement reaction), then a subsequent backfilling of Au into the hollowed-out structures. Cetyltrimethylammonium bromide (CTAB) surfactant, a key parameter, interacts with metal salt precursor to form a complex species that retards metal reduction. In addition, we demonstrate conversion of solid nano-Ag to solid nano-Pd as well as of Cu foil (10 μm thick) to shiny Au foil.

Original languageEnglish
Pages (from-to)3863-3871
Number of pages9
JournalNanoscale
Volume5
Issue number9
DOIs
Publication statusPublished - 2013 May 7

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Metal foil
Metals
Nanostructures
Prisms
Oxidants
Surface-Active Agents
Chemical reactions
Etching
Dissolution
Surface active agents
Salts
Chemical analysis
Oxidation-Reduction
cetrimonium

All Science Journal Classification (ASJC) codes

  • Materials Science(all)

Cite this

Chien, Yi Hsin ; Tsai, Ming Fong ; Shanmugam, Vijayakumar ; Sardar, Kripasindhu ; Huang, Cheng Liang ; Yeh, Chen-Sheng. / Escape from the destruction of the galvanic replacement reaction for solid → hollow → solid conversion process in one pot reaction. In: Nanoscale. 2013 ; Vol. 5, No. 9. pp. 3863-3871.
@article{919da56f67a447faa0eaa2c40692195d,
title = "Escape from the destruction of the galvanic replacement reaction for solid → hollow → solid conversion process in one pot reaction",
abstract = "Based on the difference in the redox potentials between two metal species, the galvanic replacement reaction is known to create an irreversible process to generate hollow nanostructures in a wide range of shapes. In the context of galvanic replacement reaction, continuing etching leads to the general collapse of the hollow structures because of the excess amount of oxidizing agent. We demonstrate the growth of solid nanostructures from a hollow frame-like architecture in the course of a galvanic replacement reaction without any morphology destruction. We report the successful composition transformation of solid Ag with a wide range of shapes, such as plate, decahedron, rod, prism, sphere, and foil, from as thin as <10 nm up to 5 μm and with an area of ∼4 mm2, to their solid Au counterparts using straightforward chemical reactions. The successful conversion process relies on a decrease in the reduction rate of the metallic precursor to initiate dissolution of Ag in the first stage (a galvanic replacement reaction), then a subsequent backfilling of Au into the hollowed-out structures. Cetyltrimethylammonium bromide (CTAB) surfactant, a key parameter, interacts with metal salt precursor to form a complex species that retards metal reduction. In addition, we demonstrate conversion of solid nano-Ag to solid nano-Pd as well as of Cu foil (10 μm thick) to shiny Au foil.",
author = "Chien, {Yi Hsin} and Tsai, {Ming Fong} and Vijayakumar Shanmugam and Kripasindhu Sardar and Huang, {Cheng Liang} and Chen-Sheng Yeh",
year = "2013",
month = "5",
day = "7",
doi = "10.1039/c3nr00100h",
language = "English",
volume = "5",
pages = "3863--3871",
journal = "Nanoscale",
issn = "2040-3364",
publisher = "Royal Society of Chemistry",
number = "9",

}

Escape from the destruction of the galvanic replacement reaction for solid → hollow → solid conversion process in one pot reaction. / Chien, Yi Hsin; Tsai, Ming Fong; Shanmugam, Vijayakumar; Sardar, Kripasindhu; Huang, Cheng Liang; Yeh, Chen-Sheng.

In: Nanoscale, Vol. 5, No. 9, 07.05.2013, p. 3863-3871.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Escape from the destruction of the galvanic replacement reaction for solid → hollow → solid conversion process in one pot reaction

AU - Chien, Yi Hsin

AU - Tsai, Ming Fong

AU - Shanmugam, Vijayakumar

AU - Sardar, Kripasindhu

AU - Huang, Cheng Liang

AU - Yeh, Chen-Sheng

PY - 2013/5/7

Y1 - 2013/5/7

N2 - Based on the difference in the redox potentials between two metal species, the galvanic replacement reaction is known to create an irreversible process to generate hollow nanostructures in a wide range of shapes. In the context of galvanic replacement reaction, continuing etching leads to the general collapse of the hollow structures because of the excess amount of oxidizing agent. We demonstrate the growth of solid nanostructures from a hollow frame-like architecture in the course of a galvanic replacement reaction without any morphology destruction. We report the successful composition transformation of solid Ag with a wide range of shapes, such as plate, decahedron, rod, prism, sphere, and foil, from as thin as <10 nm up to 5 μm and with an area of ∼4 mm2, to their solid Au counterparts using straightforward chemical reactions. The successful conversion process relies on a decrease in the reduction rate of the metallic precursor to initiate dissolution of Ag in the first stage (a galvanic replacement reaction), then a subsequent backfilling of Au into the hollowed-out structures. Cetyltrimethylammonium bromide (CTAB) surfactant, a key parameter, interacts with metal salt precursor to form a complex species that retards metal reduction. In addition, we demonstrate conversion of solid nano-Ag to solid nano-Pd as well as of Cu foil (10 μm thick) to shiny Au foil.

AB - Based on the difference in the redox potentials between two metal species, the galvanic replacement reaction is known to create an irreversible process to generate hollow nanostructures in a wide range of shapes. In the context of galvanic replacement reaction, continuing etching leads to the general collapse of the hollow structures because of the excess amount of oxidizing agent. We demonstrate the growth of solid nanostructures from a hollow frame-like architecture in the course of a galvanic replacement reaction without any morphology destruction. We report the successful composition transformation of solid Ag with a wide range of shapes, such as plate, decahedron, rod, prism, sphere, and foil, from as thin as <10 nm up to 5 μm and with an area of ∼4 mm2, to their solid Au counterparts using straightforward chemical reactions. The successful conversion process relies on a decrease in the reduction rate of the metallic precursor to initiate dissolution of Ag in the first stage (a galvanic replacement reaction), then a subsequent backfilling of Au into the hollowed-out structures. Cetyltrimethylammonium bromide (CTAB) surfactant, a key parameter, interacts with metal salt precursor to form a complex species that retards metal reduction. In addition, we demonstrate conversion of solid nano-Ag to solid nano-Pd as well as of Cu foil (10 μm thick) to shiny Au foil.

UR - http://www.scopus.com/inward/record.url?scp=84876706433&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84876706433&partnerID=8YFLogxK

U2 - 10.1039/c3nr00100h

DO - 10.1039/c3nr00100h

M3 - Article

VL - 5

SP - 3863

EP - 3871

JO - Nanoscale

JF - Nanoscale

SN - 2040-3364

IS - 9

ER -