Evaluation of strain measurement in a die-to-interposer chip using in situ synchrotron X-Ray diffraction and finite-element analysis

Hsueh Hsien Hsu, Tz Cheng Chiu, Tao Chih Chang, Shin Yi Huang, Hsin Yi Lee, Ching Shun Ku, Yang Yi Lin, Chien Hao Su, Li Wei Chou, Yao Tsung Ouyang, Yi Ting Huang, Albert T. Wu

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Evaluation of strain measurement in a die-to-interposer chip using in situ synchrotron X-Ray diffraction and finite-element analysis'. Together they form a unique fingerprint.

Physics & Astronomy

Engineering & Materials Science

Chemical Compounds