Evaluation of the Effects of Introducing Channels to Composite Materials to Reduce Warpage on Semiconductor Packages Due to Coefficient of Thermal Expansion Mismatch

Emmanuel Arriola, Nino Rigo Emil Lim, Roberto Louis Moran, John Patrick Mercado, Richard Dimagiba, Jeremias Gonzaga, Aristotle Ubando

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The warpage induced during the manufacturing process affects the yield, quality, and reliability of the semiconductor packages. Unavoidable and severe stress and deformation are observed because of incompatible of thermal expansion coefficient (CTE) of the materials such as the copper and ceramic that are commonly used in the semiconductor industry. The warpage and induced stress can be an unaccounted hazard that may affect the long-term durability and reliability of the semiconductor component. This paper investigates the effect of adding and removing channels to the semiconductor composite to reduce the warpage due to CTE mismatch. The effects adding or reducing the size of the channels was quantitatively examined through ANSYS simulation. A finite element method employing the thermomechanical behavior of the composite material were established to predict the effects of the channels to the warpage developed within the manufacturing process. Simulation results shows that channels can reduce the warpage by 48.76%. The proposed method was found to be effective in the reduction of warpage of the composite materials via the thermomechanical analysis using finite element method validated by values found in the available literature.

Original languageEnglish
Title of host publication2019 IEEE 11th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management, HNICEM 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728130446
DOIs
Publication statusPublished - 2019 Nov
Event11th IEEE International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management, HNICEM 2019 - Laoag, Philippines
Duration: 2019 Nov 292019 Dec 1

Publication series

Name2019 IEEE 11th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management, HNICEM 2019

Conference

Conference11th IEEE International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management, HNICEM 2019
CountryPhilippines
CityLaoag
Period19-11-2919-12-01

All Science Journal Classification (ASJC) codes

  • Artificial Intelligence
  • Computer Networks and Communications
  • Computer Science Applications
  • Information Systems and Management
  • Electrical and Electronic Engineering
  • Management, Monitoring, Policy and Law
  • Control and Optimization

Fingerprint Dive into the research topics of 'Evaluation of the Effects of Introducing Channels to Composite Materials to Reduce Warpage on Semiconductor Packages Due to Coefficient of Thermal Expansion Mismatch'. Together they form a unique fingerprint.

Cite this