Evaluation of the Effects of Introducing Channels to Composite Materials to Reduce Warpage on Semiconductor Packages Due to Coefficient of Thermal Expansion Mismatch

Emmanuel Arriola, Nino Rigo Emil Lim, Roberto Louis Moran, John Patrick Mercado, Richard Dimagiba, Jeremias Gonzaga, Aristotle Ubando

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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