Evolution of Ag3Sn compounds in solidification of eutectic Sn-3.5Ag solder

Hwa Teng Lee, Yin Fa Chen, Ting Fu Hong, Ku Ta Shih

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

The relation between cooling rate and morphology of Ag3Sn IMCs was investigated in this study. The morphology of Ag3Sn intermetallic compounds of eutectic Sn-3.5Ag solder was investigated after solidification at different cooling rates. As the nucleation time of Ag3Sn depended on cooling rate, the morphology and size of Ag3Sn compounds were affected by cooling rate. The three types of Ag3Sn compound during different cooling rate solidification were found to be particle-like, needle-like, and plate-like in Sn-3.5Ag solder. The results show that as the cooling rate decreases, the morphology of Ag3Sn formed in Sn-3.5Ag solder transforms progressively from particle-like to plate-like.

Original languageEnglish
Title of host publication2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Pages646-649
Number of pages4
DOIs
Publication statusPublished - 2009 Nov 25
Event2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 - Beijing, China
Duration: 2009 Aug 102009 Aug 13

Publication series

Name2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Other

Other2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
CountryChina
CityBeijing
Period09-08-1009-08-13

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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