Evolution of Ag3Sn compounds in solidification of eutectic Sn-3.5Ag solder

Hwa Teng Lee; Yin Fa Chen; Ting Fu Hong; Ku Ta Shih

doi:10.1109/ICEPT.2009.5270669

Evolution of Ag₃Sn compounds in solidification of eutectic Sn-3.5Ag solder

Hwa Teng Lee, Yin Fa Chen, Ting Fu Hong, Ku Ta Shih

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

6 Citations (Scopus)

Abstract

The relation between cooling rate and morphology of Ag₃Sn IMCs was investigated in this study. The morphology of Ag₃Sn intermetallic compounds of eutectic Sn-3.5Ag solder was investigated after solidification at different cooling rates. As the nucleation time of Ag₃Sn depended on cooling rate, the morphology and size of Ag₃Sn compounds were affected by cooling rate. The three types of Ag₃Sn compound during different cooling rate solidification were found to be particle-like, needle-like, and plate-like in Sn-3.5Ag solder. The results show that as the cooling rate decreases, the morphology of Ag₃Sn formed in Sn-3.5Ag solder transforms progressively from particle-like to plate-like.

Original language	English
Title of host publication	2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Pages	646-649
Number of pages	4
DOIs	https://doi.org/10.1109/ICEPT.2009.5270669
Publication status	Published - 2009
Event	2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 - Beijing, China Duration: 2009 Aug 10 → 2009 Aug 13

Publication series

Name	2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Other

Other	2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Country/Territory	China
City	Beijing
Period	09-08-10 → 09-08-13

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Access to Document

10.1109/ICEPT.2009.5270669

Cite this

Lee, H. T., Chen, Y. F., Hong, T. F., & Shih, K. T. (2009). Evolution of Ag₃Sn compounds in solidification of eutectic Sn-3.5Ag solder. In 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 (pp. 646-649). Article 5270669 (2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009). https://doi.org/10.1109/ICEPT.2009.5270669

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title = "Evolution of Ag3Sn compounds in solidification of eutectic Sn-3.5Ag solder",

abstract = "The relation between cooling rate and morphology of Ag3Sn IMCs was investigated in this study. The morphology of Ag3Sn intermetallic compounds of eutectic Sn-3.5Ag solder was investigated after solidification at different cooling rates. As the nucleation time of Ag3Sn depended on cooling rate, the morphology and size of Ag3Sn compounds were affected by cooling rate. The three types of Ag3Sn compound during different cooling rate solidification were found to be particle-like, needle-like, and plate-like in Sn-3.5Ag solder. The results show that as the cooling rate decreases, the morphology of Ag3Sn formed in Sn-3.5Ag solder transforms progressively from particle-like to plate-like.",

author = "Lee, {Hwa Teng} and Chen, {Yin Fa} and Hong, {Ting Fu} and Shih, {Ku Ta}",

year = "2009",

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booktitle = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009",

note = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 ; Conference date: 10-08-2009 Through 13-08-2009",

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Lee, HT, Chen, YF, Hong, TF & Shih, KT 2009, Evolution of Ag₃Sn compounds in solidification of eutectic Sn-3.5Ag solder. in 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009., 5270669, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, pp. 646-649, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, Beijing, China, 09-08-10. https://doi.org/10.1109/ICEPT.2009.5270669

Evolution of Ag₃Sn compounds in solidification of eutectic Sn-3.5Ag solder. / Lee, Hwa Teng; Chen, Yin Fa; Hong, Ting Fu et al.
2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. 2009. p. 646-649 5270669 (2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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N2 - The relation between cooling rate and morphology of Ag3Sn IMCs was investigated in this study. The morphology of Ag3Sn intermetallic compounds of eutectic Sn-3.5Ag solder was investigated after solidification at different cooling rates. As the nucleation time of Ag3Sn depended on cooling rate, the morphology and size of Ag3Sn compounds were affected by cooling rate. The three types of Ag3Sn compound during different cooling rate solidification were found to be particle-like, needle-like, and plate-like in Sn-3.5Ag solder. The results show that as the cooling rate decreases, the morphology of Ag3Sn formed in Sn-3.5Ag solder transforms progressively from particle-like to plate-like.

AB - The relation between cooling rate and morphology of Ag3Sn IMCs was investigated in this study. The morphology of Ag3Sn intermetallic compounds of eutectic Sn-3.5Ag solder was investigated after solidification at different cooling rates. As the nucleation time of Ag3Sn depended on cooling rate, the morphology and size of Ag3Sn compounds were affected by cooling rate. The three types of Ag3Sn compound during different cooling rate solidification were found to be particle-like, needle-like, and plate-like in Sn-3.5Ag solder. The results show that as the cooling rate decreases, the morphology of Ag3Sn formed in Sn-3.5Ag solder transforms progressively from particle-like to plate-like.

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Lee HT, Chen YF, Hong TF, Shih KT. Evolution of Ag₃Sn compounds in solidification of eutectic Sn-3.5Ag solder. In 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. 2009. p. 646-649. 5270669. (2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009). doi: 10.1109/ICEPT.2009.5270669