Abstract
The nanocomposite Ti-Si-N thin flims were prepared by reactive magnetron co-sputtering system. The experimental parameter effect on the evolution of mechanical property of nanocomposite TiSiN Films was investigated. The Ti-Si-N film is a mixed composite consisting of the Ti-Si, Ti-N and Si-N compounds. As Si is added to the polycrystalline Ti-N compound to form Ti-Si-N, the microstructure becomes nanocrystalline grains embedded in a disordered Ti-Si-N or SiNx amorphous matrix i.e. nanocomposite quasi-amorphous microstructure, which is affected by the experimental parameters of nitrogen flow ratio (FN2%, 3, 5, 10 %), Ti power (75, 100, 150 W) and Si power (100, 150 and 200 W) during co-sputtering. The thickness, structural, morphology, chemical composition and mechanical properties of films were characterized by alpha-stepper profiler, Grazing Incidence X-ray Diffraction (GIXRD), scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and nanoindenter, respectively. The experimental result shows that deposition rate decreased with increasing FN2%. According to Scherrer's formula, the grain size of films was below 5 nm. The surface morphology each film was very smooth due to fine grains. The hardness and modulus of Ti-Si-N can be enhanced by Ti power and reducing Si power. In this paper, the maximum hardness of 24.86 GPa and Young,s modulus of 183.65 GPa was obtained at Ti 150 W, Si 100 W and 5 FN%.
| Original language | English |
|---|---|
| Title of host publication | 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010 |
| Pages | 344-347 |
| Number of pages | 4 |
| DOIs | |
| Publication status | Published - 2010 Nov 29 |
| Event | 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010 - Xiamen, China Duration: 2010 Jan 20 → 2010 Jan 23 |
Publication series
| Name | 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010 |
|---|
Other
| Other | 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010 |
|---|---|
| Country | China |
| City | Xiamen |
| Period | 10-01-20 → 10-01-23 |
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All Science Journal Classification (ASJC) codes
- Control and Systems Engineering
- Electrical and Electronic Engineering
Cite this
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Evolution of mechanical property of nanocomposite TiSiN films using reactive magnetron cosputtering. / Chung, Chen-Kuei; Jhu, J. J.; Chang, S. C.; Wu, B. H.
2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010. 2010. p. 344-347 5592231 (2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Evolution of mechanical property of nanocomposite TiSiN films using reactive magnetron cosputtering
AU - Chung, Chen-Kuei
AU - Jhu, J. J.
AU - Chang, S. C.
AU - Wu, B. H.
PY - 2010/11/29
Y1 - 2010/11/29
N2 - The nanocomposite Ti-Si-N thin flims were prepared by reactive magnetron co-sputtering system. The experimental parameter effect on the evolution of mechanical property of nanocomposite TiSiN Films was investigated. The Ti-Si-N film is a mixed composite consisting of the Ti-Si, Ti-N and Si-N compounds. As Si is added to the polycrystalline Ti-N compound to form Ti-Si-N, the microstructure becomes nanocrystalline grains embedded in a disordered Ti-Si-N or SiNx amorphous matrix i.e. nanocomposite quasi-amorphous microstructure, which is affected by the experimental parameters of nitrogen flow ratio (FN2%, 3, 5, 10 %), Ti power (75, 100, 150 W) and Si power (100, 150 and 200 W) during co-sputtering. The thickness, structural, morphology, chemical composition and mechanical properties of films were characterized by alpha-stepper profiler, Grazing Incidence X-ray Diffraction (GIXRD), scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and nanoindenter, respectively. The experimental result shows that deposition rate decreased with increasing FN2%. According to Scherrer's formula, the grain size of films was below 5 nm. The surface morphology each film was very smooth due to fine grains. The hardness and modulus of Ti-Si-N can be enhanced by Ti power and reducing Si power. In this paper, the maximum hardness of 24.86 GPa and Young,s modulus of 183.65 GPa was obtained at Ti 150 W, Si 100 W and 5 FN%.
AB - The nanocomposite Ti-Si-N thin flims were prepared by reactive magnetron co-sputtering system. The experimental parameter effect on the evolution of mechanical property of nanocomposite TiSiN Films was investigated. The Ti-Si-N film is a mixed composite consisting of the Ti-Si, Ti-N and Si-N compounds. As Si is added to the polycrystalline Ti-N compound to form Ti-Si-N, the microstructure becomes nanocrystalline grains embedded in a disordered Ti-Si-N or SiNx amorphous matrix i.e. nanocomposite quasi-amorphous microstructure, which is affected by the experimental parameters of nitrogen flow ratio (FN2%, 3, 5, 10 %), Ti power (75, 100, 150 W) and Si power (100, 150 and 200 W) during co-sputtering. The thickness, structural, morphology, chemical composition and mechanical properties of films were characterized by alpha-stepper profiler, Grazing Incidence X-ray Diffraction (GIXRD), scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and nanoindenter, respectively. The experimental result shows that deposition rate decreased with increasing FN2%. According to Scherrer's formula, the grain size of films was below 5 nm. The surface morphology each film was very smooth due to fine grains. The hardness and modulus of Ti-Si-N can be enhanced by Ti power and reducing Si power. In this paper, the maximum hardness of 24.86 GPa and Young,s modulus of 183.65 GPa was obtained at Ti 150 W, Si 100 W and 5 FN%.
UR - http://www.scopus.com/inward/record.url?scp=78649256312&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=78649256312&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2010.5592231
DO - 10.1109/NEMS.2010.5592231
M3 - Conference contribution
SN - 9781424465439
T3 - 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
SP - 344
EP - 347
BT - 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
ER -