Experimental study of lapping using mixed abrasive grits

Chun-Hui Chung, Glenn Melendez, Imin Kao

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Wafers made of materials such as silicon, III-V and II-VI compounds, and optoelectronic materials, require high-degree of surface quality in order to increase the yield in micro-electronics fabrication to produce IC chips and devices. Measures of properties of surface quality of wafers include: nanotopography, surface morphology, global planarization, total thickness variation (TTV) and warp. Due to the reduction of feature size in micro-electronics fabrication, the requirements of such properties become more and more stringent. To meet such requirements, the wafer manufacturing processes of brittle semiconductor materials, such as slicing, lapping, grinding, and polishing have been continually improved. In this paper, the lapping process of wafer surface treatment is studied with experimental results of surface roughness and material removal rate. In order to improve the performance of lapping process, effects of mixed abrasive grits in the slurry of the free abrasive machining (FAM) processes are studied using a single-sided wafer-lapping machine. Under the same slurry density, experiments employing different mixing ratios of large and small abrasive grits, and various normal loadings on the wafer surface applied through a jig are conducted for parameter study. With various mixing ratios and loadings, observations and measurements such as the total amount of material removed, material removal rate, surface roughness, and relative angular velocity are presented and discussed in this paper. The experiments show that the half-half mixing ratio of abrasives removes more material than other mixing ratios under the same conditions, but with a higher surface roughness. The results of this study can provide a good reference to the FAM processes that practitioners use today by exploiting different mixing ratios and loadings of abrasive slurry in the manufacturing processes.

Original languageEnglish
Title of host publicationProceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009
Pages729-736
Number of pages8
DOIs
Publication statusPublished - 2009 Dec 1
EventASME International Manufacturing Science and Engineering Conference 2009, MSEC2009 - West Lafayette, IN, United States
Duration: 2009 Oct 42009 Oct 7

Publication series

NameProceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009
Volume1

Other

OtherASME International Manufacturing Science and Engineering Conference 2009, MSEC2009
CountryUnited States
CityWest Lafayette, IN
Period09-10-0409-10-07

Fingerprint

Lapping
Abrasives
Surface roughness
Microelectronics
Surface properties
Lapping machines
Machining
Jigs
Fabrication
Angular velocity
Polishing
Optoelectronic devices
Surface morphology
Surface treatment
Experiments
Semiconductor materials
Silicon

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering

Cite this

Chung, C-H., Melendez, G., & Kao, I. (2009). Experimental study of lapping using mixed abrasive grits. In Proceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009 (pp. 729-736). (Proceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009; Vol. 1). https://doi.org/10.1115/MSEC2009-84210
Chung, Chun-Hui ; Melendez, Glenn ; Kao, Imin. / Experimental study of lapping using mixed abrasive grits. Proceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009. 2009. pp. 729-736 (Proceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009).
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abstract = "Wafers made of materials such as silicon, III-V and II-VI compounds, and optoelectronic materials, require high-degree of surface quality in order to increase the yield in micro-electronics fabrication to produce IC chips and devices. Measures of properties of surface quality of wafers include: nanotopography, surface morphology, global planarization, total thickness variation (TTV) and warp. Due to the reduction of feature size in micro-electronics fabrication, the requirements of such properties become more and more stringent. To meet such requirements, the wafer manufacturing processes of brittle semiconductor materials, such as slicing, lapping, grinding, and polishing have been continually improved. In this paper, the lapping process of wafer surface treatment is studied with experimental results of surface roughness and material removal rate. In order to improve the performance of lapping process, effects of mixed abrasive grits in the slurry of the free abrasive machining (FAM) processes are studied using a single-sided wafer-lapping machine. Under the same slurry density, experiments employing different mixing ratios of large and small abrasive grits, and various normal loadings on the wafer surface applied through a jig are conducted for parameter study. With various mixing ratios and loadings, observations and measurements such as the total amount of material removed, material removal rate, surface roughness, and relative angular velocity are presented and discussed in this paper. The experiments show that the half-half mixing ratio of abrasives removes more material than other mixing ratios under the same conditions, but with a higher surface roughness. The results of this study can provide a good reference to the FAM processes that practitioners use today by exploiting different mixing ratios and loadings of abrasive slurry in the manufacturing processes.",
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Chung, C-H, Melendez, G & Kao, I 2009, Experimental study of lapping using mixed abrasive grits. in Proceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009. Proceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009, vol. 1, pp. 729-736, ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009, West Lafayette, IN, United States, 09-10-04. https://doi.org/10.1115/MSEC2009-84210

Experimental study of lapping using mixed abrasive grits. / Chung, Chun-Hui; Melendez, Glenn; Kao, Imin.

Proceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009. 2009. p. 729-736 (Proceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009; Vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Chung C-H, Melendez G, Kao I. Experimental study of lapping using mixed abrasive grits. In Proceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009. 2009. p. 729-736. (Proceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009). https://doi.org/10.1115/MSEC2009-84210