Fabrication and application of polyimide plastic molds for nanoimprint lithography

Chun Chang Wu, Steve Lien Chung Hsu, I. Lin Lo

Research output: Contribution to journalArticlepeer-review

12 Citations (Scopus)

Abstract

In this work, we have developed low-cost, high modulus, flexible, and UV transparent polyimide plastic molds for nanoimprint lithography (NIL). Different structures of poly(amic acids) (PAA) and polyimides (PI) have been synthesized. By casting the PAA or PI solutions on a silicon master, flexible but still rigid plastic molds can be produced. The advantages of the PI molds are: (1) high glass-transition temperatures (Tg) up to 310 °C, (2) high thermal stability over 500 °C, (3) high tensile modulus, and (4) UV transparency for use in UV-NIL. Various micrometer and nanometer scale patterns could be obtained from the PI molds on a large area (4 inch wafer). The imprinting results showed that the PI molds could be faithfully used for both hot embossing NIL and UV-NIL.

Original languageEnglish
Pages (from-to)6446-6452
Number of pages7
JournalJournal of Nanoscience and Nanotechnology
Volume10
Issue number10
DOIs
Publication statusPublished - 2010 Oct 1

All Science Journal Classification (ASJC) codes

  • Bioengineering
  • Chemistry(all)
  • Biomedical Engineering
  • Materials Science(all)
  • Condensed Matter Physics

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