Fabrication challenges for a complicated micro-flow channel system at low temperature process

C. W. Liu, C. Gau, H. S. Ko, B. T. Dai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper will present fabrication challenges for a complicated micro channel system at low temperature process by MEMS techniques. This channel will be integrated with an array of temperature sensors and a set of heaters for the purpose of study on the micro-scale heat transfer inside. The heat transfer results may provide a clue whether the microchannel cooling process can be used to solve the future cooling problem encountered in an extremely high power density CPU chip. Design and fabrication challenges encountered in this processes are discussed. A final measurement for the validation of the heaters and the sensors fabricated and a study of the heat transfer coefficient distributions inside the micro channel are also presented.

Original languageEnglish
Title of host publicationTRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers
Pages1477-1480
Number of pages4
DOIs
Publication statusPublished - 2005 Nov 9
Event13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 - Seoul, Korea, Republic of
Duration: 2005 Jun 52005 Jun 9

Publication series

NameDigest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05
Volume2

Other

Other13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05
CountryKorea, Republic of
CitySeoul
Period05-06-0505-06-09

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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