Fabrication micro-nozzle plates for inkjet print head using LIGA process

Sheng Chih Shen, Chung Jui Lee, Min Wen Wang, Yi Cheng Chen, Yu Jen Wang, Yung Yue Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper presents a novel LIGA-like process to fabricate the nozzle plate for matching the requirements of the 600 dpi inkjet printhead. This novel fabrication technique reduces the production cost from 100% current process to 50%. This mass production technique comprises two main technologies: Ni-Co electroforming and plastic injection molding. The nozzle plate consists ink channels, ink cavities, and nozzles for enhancing the integrity and excusing the assembly process. The dimensions of nozzle plate are 4.16mm in width and 7.3mm in length, respectively. Total thickness of micro-nozzle plates are thickness ≤ 100um(ink channels and ink cavities), and the diameter and pitch of the nozzle holes are 40±3um and 168±3 um, respectively. Straightly speaking, for being the main compositions of the 600 dpi inkjet printhead design, the above fabrication process is qualified enough and capable of yielding satisfactory results.

Original languageEnglish
Title of host publicationAdvanced Manufacture
Subtitle of host publicationFocusing on New and Emerging Technologies - Selected, peer Reviewed Papers from the 2007 International Conference on Advanced Manufacture
PublisherTrans Tech Publications Ltd
Pages132-137
Number of pages6
ISBN (Electronic)9780878493609
DOIs
Publication statusPublished - 2008
Event2007 SME International Conference on Advanced Manufacture, SME ICAM 2007 - Tainan, Taiwan
Duration: 2008 Nov 262008 Nov 28

Publication series

NameMaterials Science Forum
Volume594
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

Other2007 SME International Conference on Advanced Manufacture, SME ICAM 2007
Country/TerritoryTaiwan
CityTainan
Period08-11-2608-11-28

All Science Journal Classification (ASJC) codes

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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