Fabrication of a novel porous Ni-P thin-film using electroless-plating: Application to embedded thin-film resistor

Guoyun Zhou; Wei He; Shouxu Wang; Chia Yun Chen; Ching Ping Wong

doi:10.1016/j.matlet.2013.06.087

Fabrication of a novel porous Ni-P thin-film using electroless-plating: Application to embedded thin-film resistor

Guoyun Zhou, Wei He, Shouxu Wang, Chia Yun Chen, Ching Ping Wong

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

5 Citations (Scopus)

Abstract

A novel porous Ni-P alloy thin-film was developed to fabricate embedded resistor through the electroless deposition by introducing manganese ion in electrolyte solutions. SEM images demonstrated high density of pores or holes with diameters ranging from 0.1 μm to 3.0 μm was formed in Ni-P thin-film when the concentrations of MnSO₄·H₂O changed from 0 to 50 g/dm³. Resistance testing results revealed a significant increasing of resistance as the concentration of MnSO₄·H ₂O increases and thereby a quadratical relationship between them was primly fitted with low deviation of 5.75%. Moreover, to explore the application practice of this porous thin-film in embedded resistor, distribution experiment was designed to investigate resistance tolerance using maximum deviation method. Tolerances under 15% indicated this porous Ni-P thin-film is a very practical candidate to fabricate embedded resistors.

Original language	English
Pages (from-to)	75-78
Number of pages	4
Journal	Materials Letters
Volume	108
DOIs	https://doi.org/10.1016/j.matlet.2013.06.087
Publication status	Published - 2013

All Science Journal Classification (ASJC) codes

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.1016/j.matlet.2013.06.087

Cite this

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title = "Fabrication of a novel porous Ni-P thin-film using electroless-plating: Application to embedded thin-film resistor",

abstract = "A novel porous Ni-P alloy thin-film was developed to fabricate embedded resistor through the electroless deposition by introducing manganese ion in electrolyte solutions. SEM images demonstrated high density of pores or holes with diameters ranging from 0.1 μm to 3.0 μm was formed in Ni-P thin-film when the concentrations of MnSO4·H2O changed from 0 to 50 g/dm3. Resistance testing results revealed a significant increasing of resistance as the concentration of MnSO4·H 2O increases and thereby a quadratical relationship between them was primly fitted with low deviation of 5.75%. Moreover, to explore the application practice of this porous thin-film in embedded resistor, distribution experiment was designed to investigate resistance tolerance using maximum deviation method. Tolerances under 15% indicated this porous Ni-P thin-film is a very practical candidate to fabricate embedded resistors.",

author = "Guoyun Zhou and Wei He and Shouxu Wang and Chen, {Chia Yun} and Wong, {Ching Ping}",

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volume = "108",

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journal = "Materials Letters",

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T1 - Fabrication of a novel porous Ni-P thin-film using electroless-plating

T2 - Application to embedded thin-film resistor

AU - Zhou, Guoyun

AU - He, Wei

AU - Wang, Shouxu

AU - Chen, Chia Yun

AU - Wong, Ching Ping

PY - 2013

Y1 - 2013

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AB - A novel porous Ni-P alloy thin-film was developed to fabricate embedded resistor through the electroless deposition by introducing manganese ion in electrolyte solutions. SEM images demonstrated high density of pores or holes with diameters ranging from 0.1 μm to 3.0 μm was formed in Ni-P thin-film when the concentrations of MnSO4·H2O changed from 0 to 50 g/dm3. Resistance testing results revealed a significant increasing of resistance as the concentration of MnSO4·H 2O increases and thereby a quadratical relationship between them was primly fitted with low deviation of 5.75%. Moreover, to explore the application practice of this porous thin-film in embedded resistor, distribution experiment was designed to investigate resistance tolerance using maximum deviation method. Tolerances under 15% indicated this porous Ni-P thin-film is a very practical candidate to fabricate embedded resistors.

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VL - 108

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JO - Materials Letters

JF - Materials Letters

ER -

Fabrication of a novel porous Ni-P thin-film using electroless-plating: Application to embedded thin-film resistor

Abstract

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