Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging

Wei Lan Chiu, Chia Ling Lu, Han Wen Lin, Chien Min Liu, Yi Sa Huang, Tien Lin Lu, Tao Chi Liu, Hsiang Yao Hsiao, Chih Chen, Jui Chao Kuo, King Ning Tu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Due to the thousands of microbumps on a chip for 3D ICs, the precise control of the microstructure of all the material is required. The nearly <111>-oriented nanotwinned and fine-grained Cu was electroplated on a Si wafer surface and annealed at 400-500 °C for 1 h, many extremely large <100>-oriented Cu crystals with grain sizes ranging from 200 to 400 μm were obtained. The <111>-oriented Cu grains were transformed into super-large <100>-oriented grains after the annealing. In addition, we patterned the <111>-oriented Cu films into pad arrays of 25 to 100 μm in diameter and annealed the nanotwinned Cu pads with same conditions. An array of <100>-oriented single crystals Cu pads can be obtained. Otherwise, single-crystal nano-wire growth displays a process by one-dimensional anisotropic growth, in which the growth along the axial direction is much faster than in the radial direction. This study reported here a bulk-type two-dimensional crystal growth of an array of numerous <100>-oriented single crystals of Cu on Si. The growth process in 3D IC has the potential for microbump applications packaging technology.

Original languageEnglish
Title of host publicationICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages518-522
Number of pages5
ISBN (Electronic)9784904090138
DOIs
Publication statusPublished - 2015 May 20
Event2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 - Kyoto, Japan
Duration: 2015 Apr 142015 Apr 17

Publication series

NameICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference

Other

Other2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015
Country/TerritoryJapan
CityKyoto
Period15-04-1415-04-17

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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