@inproceedings{6e40f45602e0449d845d5a83c6346bfc,
title = "Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging",
abstract = "Due to the thousands of microbumps on a chip for 3D ICs, the precise control of the microstructure of all the material is required. The nearly <111>-oriented nanotwinned and fine-grained Cu was electroplated on a Si wafer surface and annealed at 400-500 °C for 1 h, many extremely large <100>-oriented Cu crystals with grain sizes ranging from 200 to 400 μm were obtained. The <111>-oriented Cu grains were transformed into super-large <100>-oriented grains after the annealing. In addition, we patterned the <111>-oriented Cu films into pad arrays of 25 to 100 μm in diameter and annealed the nanotwinned Cu pads with same conditions. An array of <100>-oriented single crystals Cu pads can be obtained. Otherwise, single-crystal nano-wire growth displays a process by one-dimensional anisotropic growth, in which the growth along the axial direction is much faster than in the radial direction. This study reported here a bulk-type two-dimensional crystal growth of an array of numerous <100>-oriented single crystals of Cu on Si. The growth process in 3D IC has the potential for microbump applications packaging technology.",
author = "Chiu, {Wei Lan} and Lu, {Chia Ling} and Lin, {Han Wen} and Liu, {Chien Min} and Huang, {Yi Sa} and Lu, {Tien Lin} and Liu, {Tao Chi} and Hsiao, {Hsiang Yao} and Chih Chen and Kuo, {Jui Chao} and Tu, {King Ning}",
note = "Publisher Copyright: {\textcopyright} 2015 The Japan Institute of Electronics Packaging.; 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 ; Conference date: 14-04-2015 Through 17-04-2015",
year = "2015",
month = may,
day = "20",
doi = "10.1109/ICEP-IAAC.2015.7111069",
language = "English",
series = "ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "518--522",
booktitle = "ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference",
address = "United States",
}