Fabrication of diamond and diamond-like carbon molds for nano-imprinting lithography

Jay Wang Chieh Yu, Chiao Yang Cheng, Yoou Bin Guo, Franklin Chau-Nan Hong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Micro- and nano-scale molds were fabricated using nanocrystalline diamond (nano-diamond) and diamond-like carbon (DLC) films for imprinting lithography. Patterning was first transferred to the resist on nano-diamond and DLC thin films by photolithography and imprint lithography methods, and then deep etching with inductively-coupled plasma reactive ion etching (ICP-RIE) was applied to transfer patterns to nano-diamond and DLC films for the fabrication of diamond molds. Nano-diamond films of about 1.5μm in thickness were deposited on silicon substrates by hot filament chemical vapor deposition (HFCVD) by controlling CH4/H2 ratios and substrate temperatures. Thick diamond-like carbon films containing silicon oxide nanoparticles were deposited on silicon substrates by PECVD using gaseous HMDSO (Hexamethyldisiloxane) reactants to release the film stress. E-beam writer was used to pattern the resist on the Cr film-covered thick DLC film. By using ICP-RIE, Cr film was first patterned with the patterned e-beam resist as the etching mask, and then DLC thick film was etched to form nanoimprint mold using the patterned Cr as the etching mask. High fidelity nano-patterns were transferred with nano-imprinting lithography using the nano-diamond and DLC molds. Good mold releasing behavior and high mold strength were observed for the nanocrystalline diamond and DLC molds due to their highly hydrophobic surface and high toughness, respectively.

Original languageEnglish
Title of host publicationLithography Asia 2009
DOIs
Publication statusPublished - 2009 Dec 1
Event2009 Lithography Asia Conference - Taipei, Taiwan
Duration: 2009 Nov 182009 Nov 19

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume7520
ISSN (Print)0277-786X

Other

Other2009 Lithography Asia Conference
CountryTaiwan
CityTaipei
Period09-11-1809-11-19

Fingerprint

Diamond
Molds
Strombus or kite or diamond
Lithography
Diamonds
Fabrication
Carbon
lithography
diamonds
fabrication
carbon
Diamond like carbon films
Etching
etching
Plasma etching
Carbon films
Reactive ion etching
Inductively coupled plasma
Silicon
Resist

All Science Journal Classification (ASJC) codes

  • Applied Mathematics
  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Yu, J. W. C., Cheng, C. Y., Guo, Y. B., & Hong, F. C-N. (2009). Fabrication of diamond and diamond-like carbon molds for nano-imprinting lithography. In Lithography Asia 2009 [752028] (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 7520). https://doi.org/10.1117/12.837217
Yu, Jay Wang Chieh ; Cheng, Chiao Yang ; Guo, Yoou Bin ; Hong, Franklin Chau-Nan. / Fabrication of diamond and diamond-like carbon molds for nano-imprinting lithography. Lithography Asia 2009. 2009. (Proceedings of SPIE - The International Society for Optical Engineering).
@inproceedings{d238803e4d474fb1bfe871c3676fdf3c,
title = "Fabrication of diamond and diamond-like carbon molds for nano-imprinting lithography",
abstract = "Micro- and nano-scale molds were fabricated using nanocrystalline diamond (nano-diamond) and diamond-like carbon (DLC) films for imprinting lithography. Patterning was first transferred to the resist on nano-diamond and DLC thin films by photolithography and imprint lithography methods, and then deep etching with inductively-coupled plasma reactive ion etching (ICP-RIE) was applied to transfer patterns to nano-diamond and DLC films for the fabrication of diamond molds. Nano-diamond films of about 1.5μm in thickness were deposited on silicon substrates by hot filament chemical vapor deposition (HFCVD) by controlling CH4/H2 ratios and substrate temperatures. Thick diamond-like carbon films containing silicon oxide nanoparticles were deposited on silicon substrates by PECVD using gaseous HMDSO (Hexamethyldisiloxane) reactants to release the film stress. E-beam writer was used to pattern the resist on the Cr film-covered thick DLC film. By using ICP-RIE, Cr film was first patterned with the patterned e-beam resist as the etching mask, and then DLC thick film was etched to form nanoimprint mold using the patterned Cr as the etching mask. High fidelity nano-patterns were transferred with nano-imprinting lithography using the nano-diamond and DLC molds. Good mold releasing behavior and high mold strength were observed for the nanocrystalline diamond and DLC molds due to their highly hydrophobic surface and high toughness, respectively.",
author = "Yu, {Jay Wang Chieh} and Cheng, {Chiao Yang} and Guo, {Yoou Bin} and Hong, {Franklin Chau-Nan}",
year = "2009",
month = "12",
day = "1",
doi = "10.1117/12.837217",
language = "English",
isbn = "9780819479099",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
booktitle = "Lithography Asia 2009",

}

Yu, JWC, Cheng, CY, Guo, YB & Hong, FC-N 2009, Fabrication of diamond and diamond-like carbon molds for nano-imprinting lithography. in Lithography Asia 2009., 752028, Proceedings of SPIE - The International Society for Optical Engineering, vol. 7520, 2009 Lithography Asia Conference, Taipei, Taiwan, 09-11-18. https://doi.org/10.1117/12.837217

Fabrication of diamond and diamond-like carbon molds for nano-imprinting lithography. / Yu, Jay Wang Chieh; Cheng, Chiao Yang; Guo, Yoou Bin; Hong, Franklin Chau-Nan.

Lithography Asia 2009. 2009. 752028 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 7520).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Fabrication of diamond and diamond-like carbon molds for nano-imprinting lithography

AU - Yu, Jay Wang Chieh

AU - Cheng, Chiao Yang

AU - Guo, Yoou Bin

AU - Hong, Franklin Chau-Nan

PY - 2009/12/1

Y1 - 2009/12/1

N2 - Micro- and nano-scale molds were fabricated using nanocrystalline diamond (nano-diamond) and diamond-like carbon (DLC) films for imprinting lithography. Patterning was first transferred to the resist on nano-diamond and DLC thin films by photolithography and imprint lithography methods, and then deep etching with inductively-coupled plasma reactive ion etching (ICP-RIE) was applied to transfer patterns to nano-diamond and DLC films for the fabrication of diamond molds. Nano-diamond films of about 1.5μm in thickness were deposited on silicon substrates by hot filament chemical vapor deposition (HFCVD) by controlling CH4/H2 ratios and substrate temperatures. Thick diamond-like carbon films containing silicon oxide nanoparticles were deposited on silicon substrates by PECVD using gaseous HMDSO (Hexamethyldisiloxane) reactants to release the film stress. E-beam writer was used to pattern the resist on the Cr film-covered thick DLC film. By using ICP-RIE, Cr film was first patterned with the patterned e-beam resist as the etching mask, and then DLC thick film was etched to form nanoimprint mold using the patterned Cr as the etching mask. High fidelity nano-patterns were transferred with nano-imprinting lithography using the nano-diamond and DLC molds. Good mold releasing behavior and high mold strength were observed for the nanocrystalline diamond and DLC molds due to their highly hydrophobic surface and high toughness, respectively.

AB - Micro- and nano-scale molds were fabricated using nanocrystalline diamond (nano-diamond) and diamond-like carbon (DLC) films for imprinting lithography. Patterning was first transferred to the resist on nano-diamond and DLC thin films by photolithography and imprint lithography methods, and then deep etching with inductively-coupled plasma reactive ion etching (ICP-RIE) was applied to transfer patterns to nano-diamond and DLC films for the fabrication of diamond molds. Nano-diamond films of about 1.5μm in thickness were deposited on silicon substrates by hot filament chemical vapor deposition (HFCVD) by controlling CH4/H2 ratios and substrate temperatures. Thick diamond-like carbon films containing silicon oxide nanoparticles were deposited on silicon substrates by PECVD using gaseous HMDSO (Hexamethyldisiloxane) reactants to release the film stress. E-beam writer was used to pattern the resist on the Cr film-covered thick DLC film. By using ICP-RIE, Cr film was first patterned with the patterned e-beam resist as the etching mask, and then DLC thick film was etched to form nanoimprint mold using the patterned Cr as the etching mask. High fidelity nano-patterns were transferred with nano-imprinting lithography using the nano-diamond and DLC molds. Good mold releasing behavior and high mold strength were observed for the nanocrystalline diamond and DLC molds due to their highly hydrophobic surface and high toughness, respectively.

UR - http://www.scopus.com/inward/record.url?scp=77952053060&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77952053060&partnerID=8YFLogxK

U2 - 10.1117/12.837217

DO - 10.1117/12.837217

M3 - Conference contribution

SN - 9780819479099

T3 - Proceedings of SPIE - The International Society for Optical Engineering

BT - Lithography Asia 2009

ER -

Yu JWC, Cheng CY, Guo YB, Hong FC-N. Fabrication of diamond and diamond-like carbon molds for nano-imprinting lithography. In Lithography Asia 2009. 2009. 752028. (Proceedings of SPIE - The International Society for Optical Engineering). https://doi.org/10.1117/12.837217