Abstract
Micro- and nano-scale molds were fabricated using nanocrystalline diamond (nano-diamond) and diamond-like carbon (DLC) films for imprinting lithography. Patterning was first transferred to the resist on nano-diamond and DLC thin films by photolithography and imprint lithography methods, and then deep etching with inductively-coupled plasma reactive ion etching (ICP-RIE) was applied to transfer patterns to nano-diamond and DLC films for the fabrication of diamond molds. Nano-diamond films of about 1.5μm in thickness were deposited on silicon substrates by hot filament chemical vapor deposition (HFCVD) by controlling CH4/H2 ratios and substrate temperatures. Thick diamond-like carbon films containing silicon oxide nanoparticles were deposited on silicon substrates by PECVD using gaseous HMDSO (Hexamethyldisiloxane) reactants to release the film stress. E-beam writer was used to pattern the resist on the Cr film-covered thick DLC film. By using ICP-RIE, Cr film was first patterned with the patterned e-beam resist as the etching mask, and then DLC thick film was etched to form nanoimprint mold using the patterned Cr as the etching mask. High fidelity nano-patterns were transferred with nano-imprinting lithography using the nano-diamond and DLC molds. Good mold releasing behavior and high mold strength were observed for the nanocrystalline diamond and DLC molds due to their highly hydrophobic surface and high toughness, respectively.
| Original language | English |
|---|---|
| Title of host publication | Lithography Asia 2009 |
| DOIs | |
| Publication status | Published - 2009 Dec 1 |
| Event | 2009 Lithography Asia Conference - Taipei, Taiwan Duration: 2009 Nov 18 → 2009 Nov 19 |
Publication series
| Name | Proceedings of SPIE - The International Society for Optical Engineering |
|---|---|
| Volume | 7520 |
| ISSN (Print) | 0277-786X |
Other
| Other | 2009 Lithography Asia Conference |
|---|---|
| Country | Taiwan |
| City | Taipei |
| Period | 09-11-18 → 09-11-19 |
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All Science Journal Classification (ASJC) codes
- Applied Mathematics
- Computer Science Applications
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
Cite this
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Fabrication of diamond and diamond-like carbon molds for nano-imprinting lithography. / Yu, Jay Wang Chieh; Cheng, Chiao Yang; Guo, Yoou Bin; Hong, Franklin Chau-Nan.
Lithography Asia 2009. 2009. 752028 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 7520).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Fabrication of diamond and diamond-like carbon molds for nano-imprinting lithography
AU - Yu, Jay Wang Chieh
AU - Cheng, Chiao Yang
AU - Guo, Yoou Bin
AU - Hong, Franklin Chau-Nan
PY - 2009/12/1
Y1 - 2009/12/1
N2 - Micro- and nano-scale molds were fabricated using nanocrystalline diamond (nano-diamond) and diamond-like carbon (DLC) films for imprinting lithography. Patterning was first transferred to the resist on nano-diamond and DLC thin films by photolithography and imprint lithography methods, and then deep etching with inductively-coupled plasma reactive ion etching (ICP-RIE) was applied to transfer patterns to nano-diamond and DLC films for the fabrication of diamond molds. Nano-diamond films of about 1.5μm in thickness were deposited on silicon substrates by hot filament chemical vapor deposition (HFCVD) by controlling CH4/H2 ratios and substrate temperatures. Thick diamond-like carbon films containing silicon oxide nanoparticles were deposited on silicon substrates by PECVD using gaseous HMDSO (Hexamethyldisiloxane) reactants to release the film stress. E-beam writer was used to pattern the resist on the Cr film-covered thick DLC film. By using ICP-RIE, Cr film was first patterned with the patterned e-beam resist as the etching mask, and then DLC thick film was etched to form nanoimprint mold using the patterned Cr as the etching mask. High fidelity nano-patterns were transferred with nano-imprinting lithography using the nano-diamond and DLC molds. Good mold releasing behavior and high mold strength were observed for the nanocrystalline diamond and DLC molds due to their highly hydrophobic surface and high toughness, respectively.
AB - Micro- and nano-scale molds were fabricated using nanocrystalline diamond (nano-diamond) and diamond-like carbon (DLC) films for imprinting lithography. Patterning was first transferred to the resist on nano-diamond and DLC thin films by photolithography and imprint lithography methods, and then deep etching with inductively-coupled plasma reactive ion etching (ICP-RIE) was applied to transfer patterns to nano-diamond and DLC films for the fabrication of diamond molds. Nano-diamond films of about 1.5μm in thickness were deposited on silicon substrates by hot filament chemical vapor deposition (HFCVD) by controlling CH4/H2 ratios and substrate temperatures. Thick diamond-like carbon films containing silicon oxide nanoparticles were deposited on silicon substrates by PECVD using gaseous HMDSO (Hexamethyldisiloxane) reactants to release the film stress. E-beam writer was used to pattern the resist on the Cr film-covered thick DLC film. By using ICP-RIE, Cr film was first patterned with the patterned e-beam resist as the etching mask, and then DLC thick film was etched to form nanoimprint mold using the patterned Cr as the etching mask. High fidelity nano-patterns were transferred with nano-imprinting lithography using the nano-diamond and DLC molds. Good mold releasing behavior and high mold strength were observed for the nanocrystalline diamond and DLC molds due to their highly hydrophobic surface and high toughness, respectively.
UR - http://www.scopus.com/inward/record.url?scp=77952053060&partnerID=8YFLogxK
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U2 - 10.1117/12.837217
DO - 10.1117/12.837217
M3 - Conference contribution
SN - 9780819479099
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Lithography Asia 2009
ER -