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Fabrication of high wettability gradient on copper substrate
Ding Jun Huang,
Tzong Shyng Leu
Institute of Civil Aviation
International Bachelor Degree Program on Energy Engineering
Research output
:
Contribution to journal
›
Article
›
peer-review
71
Citations (Scopus)
Overview
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Engineering & Materials Science
Wetting
95%
Copper
76%
Superhydrophilicity
66%
Substrates
65%
Contact angle
58%
Superhydrophobicity
53%
Condensation
40%
Heat transfer
26%
Fluorination
22%
Photolithography
16%
Polytetrafluoroethylenes
15%
Surface treatment
14%
Physics & Astronomy
wettability
100%
copper
66%
gradients
61%
fabrication
56%
condensation
35%
heat transfer
31%
fluorination
18%
teflon (trademark)
15%
photolithography
14%
submerging
13%
Chemical Compounds
Heat Transfer
50%
Condensation
34%
Surface
29%
Fluorination
16%
Poly(tetrafluoroethylene)
16%
Surface Modification
13%