Fabrication of seamless roller mold with excimer laser direct writing technology

Yung Chun Lee, Pin Chang Chen, Hung Yi Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

This paper presents a new method for fabricating a seamless roller mold with micrometer-scaled features based on laser direct writing approach. In the process, a glass roller is first coated with a metal thin film. A high-energy pulsed laser directly machines the metal thin film and thus defines the pattern on the roller's surface. Subsequent wet etching on the patterned roller using the residual metal layer as the etching mask completes the fabrication of seamless glass roller molds. Digital image processing techniques are incorporated into the laser machining processes so that complicated patterns can be successfully transferred. Experimental results demonstrate a smallest feature size down to 20 J1m for both linear grating and dot-array patterns. The advantages of this method are: (1). seamless patterns on roller mold, (2). good machining accuracy, (3). easiness in achieving complicated patterns, and (4). low cost. This method opens up many new directions and possibilities in the applications of roller-imprinting for continuous, large-area, and low-cost fabrication of micro-structures.

Original languageEnglish
Title of host publication4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009
Pages767-770
Number of pages4
DOIs
Publication statusPublished - 2009
Event4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009 - Shenzhen, China
Duration: 2009 Jan 52009 Jan 8

Publication series

Name4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009

Other

Other4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009
Country/TerritoryChina
CityShenzhen
Period09-01-0509-01-08

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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