Fabrication of three-dimensional and submicrometer-scaled microstructures based on metal contact printing and silicon bulk machining

Kuo Lun Kao, Cho Wei Chang, Yung Chun Lee

Research output: Contribution to journalArticlepeer-review

Abstract

This paper describes a method that contains a series of processes for producing three-dimensional (3-D) microstructures with a feature size in the submicrometer scale. It starts from using a metal contact printing lithography to pattern a thin metal film on the surface of a (100) silicon substrate. The metal film has a hole-array pattern with a hole diameter ranging from 300 nm to 800 nm and is used as an etching mask for silicon bulk machining to create concave pyramid-shaped surface microstructures. Using this bulk-machined silicon substrate as a template, polymer 3-D microstructures are replicated on top of a silicon dioxide (SiO2) layer. Finally, through a dry etching process, 3-D microstructures with a profile similar to the replicated polymer microstructures are formed on the SiO2 layer. Potential applications of these fabricated SiO2 microstructures in the light-emitting diode industry will be addressed.

Original languageEnglish
Article number023008
JournalJournal of Micro/Nanolithography, MEMS, and MOEMS
Volume13
Issue number2
DOIs
Publication statusPublished - 2014 Apr

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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