Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials

I. Tseng Tang, Han Jan Chen, Mau-phon Houng, Yeong-Her Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Due to the increasing variety and capacity of information and communication media, systems of microwave band communication have branched out extensively. Surface acoustic wave (SAW) devices are commonly used in microwave applications, primarily because these devices can be fabricated by using photolithographic processes, and easily integrated into other passive and active devices. SAW devices have been successfully employed for various commercial applications, such as intermediate-frequency (IF) filters for televisions and radio-frequency (RF) filters for mobile telecommunications, using small size and mass-production fabrication processes. We apply the principles of surface acoustic wave and microwave theory, by properly designed circuit with cross-coupled combination, the conventional photolithography and lift-off technique were applied for metal pattern fabrication on the 128°-rotated YX-cut LiNbO3 piezoelectric material substrate.

Original languageEnglish
Title of host publicationProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages457-462
Number of pages6
ISBN (Electronic)078037682X, 9780780376823
DOIs
Publication statusPublished - 2002 Jan 1
Event4th International Symposium on Electronic Materials and Packaging, EMAP 2002 - Kaohsiung, Taiwan
Duration: 2002 Dec 42002 Dec 6

Publication series

NameProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Other

Other4th International Symposium on Electronic Materials and Packaging, EMAP 2002
CountryTaiwan
CityKaohsiung
Period02-12-0402-12-06

Fingerprint

Acoustic surface wave devices
Piezoelectric materials
Microwaves
Fabrication
Communication
Photolithography
Television
Surface waves
Telecommunication
Metals
Acoustic waves
Networks (circuits)
Substrates

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Materials Science(all)

Cite this

Tang, I. T., Chen, H. J., Houng, M., & Wang, Y-H. (2002). Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials. In Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 (pp. 457-462). [1188882] (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMAP.2002.1188882
Tang, I. Tseng ; Chen, Han Jan ; Houng, Mau-phon ; Wang, Yeong-Her. / Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials. Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., 2002. pp. 457-462 (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).
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Tang, IT, Chen, HJ, Houng, M & Wang, Y-H 2002, Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials. in Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002., 1188882, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002, Institute of Electrical and Electronics Engineers Inc., pp. 457-462, 4th International Symposium on Electronic Materials and Packaging, EMAP 2002, Kaohsiung, Taiwan, 02-12-04. https://doi.org/10.1109/EMAP.2002.1188882

Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials. / Tang, I. Tseng; Chen, Han Jan; Houng, Mau-phon; Wang, Yeong-Her.

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., 2002. p. 457-462 1188882 (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Tang IT, Chen HJ, Houng M, Wang Y-H. Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials. In Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc. 2002. p. 457-462. 1188882. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). https://doi.org/10.1109/EMAP.2002.1188882