TY - GEN
T1 - Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials
AU - Tang, I. Tseng
AU - Chen, Han Jan
AU - Houng, Mau Phon
AU - Wang, Yeong Her
PY - 2002/1/1
Y1 - 2002/1/1
N2 - Due to the increasing variety and capacity of information and communication media, systems of microwave band communication have branched out extensively. Surface acoustic wave (SAW) devices are commonly used in microwave applications, primarily because these devices can be fabricated by using photolithographic processes, and easily integrated into other passive and active devices. SAW devices have been successfully employed for various commercial applications, such as intermediate-frequency (IF) filters for televisions and radio-frequency (RF) filters for mobile telecommunications, using small size and mass-production fabrication processes. We apply the principles of surface acoustic wave and microwave theory, by properly designed circuit with cross-coupled combination, the conventional photolithography and lift-off technique were applied for metal pattern fabrication on the 128°-rotated YX-cut LiNbO3 piezoelectric material substrate.
AB - Due to the increasing variety and capacity of information and communication media, systems of microwave band communication have branched out extensively. Surface acoustic wave (SAW) devices are commonly used in microwave applications, primarily because these devices can be fabricated by using photolithographic processes, and easily integrated into other passive and active devices. SAW devices have been successfully employed for various commercial applications, such as intermediate-frequency (IF) filters for televisions and radio-frequency (RF) filters for mobile telecommunications, using small size and mass-production fabrication processes. We apply the principles of surface acoustic wave and microwave theory, by properly designed circuit with cross-coupled combination, the conventional photolithography and lift-off technique were applied for metal pattern fabrication on the 128°-rotated YX-cut LiNbO3 piezoelectric material substrate.
UR - http://www.scopus.com/inward/record.url?scp=84966655550&partnerID=8YFLogxK
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U2 - 10.1109/EMAP.2002.1188882
DO - 10.1109/EMAP.2002.1188882
M3 - Conference contribution
AN - SCOPUS:84966655550
T3 - Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
SP - 457
EP - 462
BT - Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
Y2 - 4 December 2002 through 6 December 2002
ER -