Abstract
Due to the increasing variety and capacity of information and communication media, systems of microwave band communication have branched out extensively. Surface acoustic wave (SAW) devices are commonly used in microwave applications, primarily because these devices can be fabricated by using photolithographic processes, and easily integrated into other passive and active devices. SAW devices have been successfully employed for various commercial applications, such as intermediate-frequency (IF) filters for televisions and radio-frequency (RF) filters for mobile telecommunications, using small size and mass-production fabrication processes. We apply the principles of surface acoustic wave and microwave theory, by properly designed circuit with cross-coupled combination, the conventional photolithography and lift-off technique were applied for metal pattern fabrication on the 128°-rotated YX-cut LiNbO3 piezoelectric material substrate.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 457-462 |
| Number of pages | 6 |
| ISBN (Electronic) | 078037682X, 9780780376823 |
| DOIs | |
| Publication status | Published - 2002 Jan 1 |
| Event | 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 - Kaohsiung, Taiwan Duration: 2002 Dec 4 → 2002 Dec 6 |
Publication series
| Name | Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 |
|---|
Other
| Other | 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 |
|---|---|
| Country | Taiwan |
| City | Kaohsiung |
| Period | 02-12-04 → 02-12-06 |
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All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
- Materials Science(all)
Cite this
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Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials. / Tang, I. Tseng; Chen, Han Jan; Houng, Mau-phon; Wang, Yeong-Her.
Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., 2002. p. 457-462 1188882 (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials
AU - Tang, I. Tseng
AU - Chen, Han Jan
AU - Houng, Mau-phon
AU - Wang, Yeong-Her
PY - 2002/1/1
Y1 - 2002/1/1
N2 - Due to the increasing variety and capacity of information and communication media, systems of microwave band communication have branched out extensively. Surface acoustic wave (SAW) devices are commonly used in microwave applications, primarily because these devices can be fabricated by using photolithographic processes, and easily integrated into other passive and active devices. SAW devices have been successfully employed for various commercial applications, such as intermediate-frequency (IF) filters for televisions and radio-frequency (RF) filters for mobile telecommunications, using small size and mass-production fabrication processes. We apply the principles of surface acoustic wave and microwave theory, by properly designed circuit with cross-coupled combination, the conventional photolithography and lift-off technique were applied for metal pattern fabrication on the 128°-rotated YX-cut LiNbO3 piezoelectric material substrate.
AB - Due to the increasing variety and capacity of information and communication media, systems of microwave band communication have branched out extensively. Surface acoustic wave (SAW) devices are commonly used in microwave applications, primarily because these devices can be fabricated by using photolithographic processes, and easily integrated into other passive and active devices. SAW devices have been successfully employed for various commercial applications, such as intermediate-frequency (IF) filters for televisions and radio-frequency (RF) filters for mobile telecommunications, using small size and mass-production fabrication processes. We apply the principles of surface acoustic wave and microwave theory, by properly designed circuit with cross-coupled combination, the conventional photolithography and lift-off technique were applied for metal pattern fabrication on the 128°-rotated YX-cut LiNbO3 piezoelectric material substrate.
UR - http://www.scopus.com/inward/record.url?scp=84966655550&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84966655550&partnerID=8YFLogxK
U2 - 10.1109/EMAP.2002.1188882
DO - 10.1109/EMAP.2002.1188882
M3 - Conference contribution
T3 - Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
SP - 457
EP - 462
BT - Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
PB - Institute of Electrical and Electronics Engineers Inc.
ER -