Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials

I. Tseng Tang; Han Jan Chen; Mau Phon Houng; Yeong Her Wang

doi:10.1109/EMAP.2002.1188882

Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials

I. Tseng Tang, Han Jan Chen, Mau Phon Houng, Yeong Her Wang

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Due to the increasing variety and capacity of information and communication media, systems of microwave band communication have branched out extensively. Surface acoustic wave (SAW) devices are commonly used in microwave applications, primarily because these devices can be fabricated by using photolithographic processes, and easily integrated into other passive and active devices. SAW devices have been successfully employed for various commercial applications, such as intermediate-frequency (IF) filters for televisions and radio-frequency (RF) filters for mobile telecommunications, using small size and mass-production fabrication processes. We apply the principles of surface acoustic wave and microwave theory, by properly designed circuit with cross-coupled combination, the conventional photolithography and lift-off technique were applied for metal pattern fabrication on the 128°-rotated YX-cut LiNbO₃ piezoelectric material substrate.

Original language	English
Title of host publication	Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	457-462
Number of pages	6
ISBN (Electronic)	078037682X, 9780780376823
DOIs	https://doi.org/10.1109/EMAP.2002.1188882
Publication status	Published - 2002 Jan 1
Event	4th International Symposium on Electronic Materials and Packaging, EMAP 2002 - Kaohsiung, Taiwan Duration: 2002 Dec 4 → 2002 Dec 6

Publication series

Name	Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Other

Other	4th International Symposium on Electronic Materials and Packaging, EMAP 2002
Country	Taiwan
City	Kaohsiung
Period	02-12-04 → 02-12-06

Fingerprint

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Materials Science(all)

Cite this

Tang, I. T., Chen, H. J., Houng, M. P., & Wang, Y. H. (2002). Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials. In Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 (pp. 457-462). [1188882] (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMAP.2002.1188882

Tang, I. Tseng ; Chen, Han Jan ; Houng, Mau Phon ; Wang, Yeong Her. / Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials. Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., 2002. pp. 457-462 (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

@inproceedings{71d185233c7c4387b97ef0004d2dec23,

title = "Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials",

abstract = "Due to the increasing variety and capacity of information and communication media, systems of microwave band communication have branched out extensively. Surface acoustic wave (SAW) devices are commonly used in microwave applications, primarily because these devices can be fabricated by using photolithographic processes, and easily integrated into other passive and active devices. SAW devices have been successfully employed for various commercial applications, such as intermediate-frequency (IF) filters for televisions and radio-frequency (RF) filters for mobile telecommunications, using small size and mass-production fabrication processes. We apply the principles of surface acoustic wave and microwave theory, by properly designed circuit with cross-coupled combination, the conventional photolithography and lift-off technique were applied for metal pattern fabrication on the 128°-rotated YX-cut LiNbO3 piezoelectric material substrate.",

author = "Tang, {I. Tseng} and Chen, {Han Jan} and Houng, {Mau Phon} and Wang, {Yeong Her}",

year = "2002",

month = "1",

day = "1",

doi = "10.1109/EMAP.2002.1188882",

language = "English",

series = "Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "457--462",

booktitle = "Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002",

address = "United States",

note = "4th International Symposium on Electronic Materials and Packaging, EMAP 2002 ; Conference date: 04-12-2002 Through 06-12-2002",

}

Tang, IT, Chen, HJ, Houng, MP & Wang, YH 2002, Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials. in Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002., 1188882, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002, Institute of Electrical and Electronics Engineers Inc., pp. 457-462, 4th International Symposium on Electronic Materials and Packaging, EMAP 2002, Kaohsiung, Taiwan, 02-12-04. https://doi.org/10.1109/EMAP.2002.1188882

Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials. / Tang, I. Tseng; Chen, Han Jan; Houng, Mau Phon ; Wang, Yeong Her.

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., 2002. p. 457-462 1188882 (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials

AU - Tang, I. Tseng

AU - Chen, Han Jan

AU - Houng, Mau Phon

AU - Wang, Yeong Her

PY - 2002/1/1

Y1 - 2002/1/1

N2 - Due to the increasing variety and capacity of information and communication media, systems of microwave band communication have branched out extensively. Surface acoustic wave (SAW) devices are commonly used in microwave applications, primarily because these devices can be fabricated by using photolithographic processes, and easily integrated into other passive and active devices. SAW devices have been successfully employed for various commercial applications, such as intermediate-frequency (IF) filters for televisions and radio-frequency (RF) filters for mobile telecommunications, using small size and mass-production fabrication processes. We apply the principles of surface acoustic wave and microwave theory, by properly designed circuit with cross-coupled combination, the conventional photolithography and lift-off technique were applied for metal pattern fabrication on the 128°-rotated YX-cut LiNbO3 piezoelectric material substrate.

AB - Due to the increasing variety and capacity of information and communication media, systems of microwave band communication have branched out extensively. Surface acoustic wave (SAW) devices are commonly used in microwave applications, primarily because these devices can be fabricated by using photolithographic processes, and easily integrated into other passive and active devices. SAW devices have been successfully employed for various commercial applications, such as intermediate-frequency (IF) filters for televisions and radio-frequency (RF) filters for mobile telecommunications, using small size and mass-production fabrication processes. We apply the principles of surface acoustic wave and microwave theory, by properly designed circuit with cross-coupled combination, the conventional photolithography and lift-off technique were applied for metal pattern fabrication on the 128°-rotated YX-cut LiNbO3 piezoelectric material substrate.

UR - http://www.scopus.com/inward/record.url?scp=84966655550&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84966655550&partnerID=8YFLogxK

U2 - 10.1109/EMAP.2002.1188882

DO - 10.1109/EMAP.2002.1188882

M3 - Conference contribution

AN - SCOPUS:84966655550

T3 - Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

SP - 457

EP - 462

BT - Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Y2 - 4 December 2002 through 6 December 2002

ER -

Tang IT, Chen HJ, Houng MP , Wang YH. Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials. In Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc. 2002. p. 457-462. 1188882. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). https://doi.org/10.1109/EMAP.2002.1188882

Access to Document

10.1109/EMAP.2002.1188882