@inproceedings{223308b55fa24068b424f8bf7e979349,
title = "Fast Steady-State Thermal Analysis",
abstract = "Thermal issues are gaining critical in system-on-a-chip. We propose a two-stage thermal analysis approach using big and little matrix operations with a matrix compression method in general successive over-relaxation (SOR) to speed up the analysis of a steady-state thermal profile, referred to as TSA. Experimental results show that the analysis performance of TSA is faster than the general SOR by 2145× in average and faster than the popular Supernodal LU (SuperLU) at least by 1.55× for large size of sparse matrices.",
author = "Chiou, {Lih Yih} and Chang, {Chun Hao} and Lu, {Liang Ying} and Yang, {Wei Hsuan} and Chang, {Yeong Jar} and Lu, {Juin Ming}",
note = "Funding Information: The authors would like to thank the Taiwan Ministry of Science and Technology for research grant (MOST 107-2634-F-006-002 -). Publisher Copyright: {\textcopyright} 2018 IEEE.; 15th International SoC Design Conference, ISOCC 2018 ; Conference date: 12-11-2018 Through 15-11-2018",
year = "2018",
month = jul,
day = "2",
doi = "10.1109/ISOCC.2018.8649912",
language = "English",
series = "Proceedings - International SoC Design Conference 2018, ISOCC 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "15--16",
booktitle = "Proceedings - International SoC Design Conference 2018, ISOCC 2018",
address = "United States",
}