Fast Steady-State Thermal Analysis

Lih Yih Chiou, Chun Hao Chang, Liang Ying Lu, Wei Hsuan Yang, Yeong Jar Chang, Juin Ming Lu

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Thermal issues are gaining critical in system-on-a-chip. We propose a two-stage thermal analysis approach using big and little matrix operations with a matrix compression method in general successive over-relaxation (SOR) to speed up the analysis of a steady-state thermal profile, referred to as TSA. Experimental results show that the analysis performance of TSA is faster than the general SOR by 2145× in average and faster than the popular Supernodal LU (SuperLU) at least by 1.55× for large size of sparse matrices.

Original languageEnglish
Title of host publicationProceedings - International SoC Design Conference 2018, ISOCC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages2
ISBN (Electronic)9781538679609
Publication statusPublished - 2018 Jul 2
Event15th International SoC Design Conference, ISOCC 2018 - Daegu, Korea, Republic of
Duration: 2018 Nov 122018 Nov 15

Publication series

NameProceedings - International SoC Design Conference 2018, ISOCC 2018


Conference15th International SoC Design Conference, ISOCC 2018
Country/TerritoryKorea, Republic of

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials


Dive into the research topics of 'Fast Steady-State Thermal Analysis'. Together they form a unique fingerprint.

Cite this