Abstract
Thermal issues are gaining critical in system-on-a-chip. We propose a two-stage thermal analysis approach using big and little matrix operations with a matrix compression method in general successive over-relaxation (SOR) to speed up the analysis of a steady-state thermal profile, referred to as TSA. Experimental results show that the analysis performance of TSA is faster than the general SOR by 2145× in average and faster than the popular Supernodal LU (SuperLU) at least by 1.55× for large size of sparse matrices.
| Original language | English |
|---|---|
| Title of host publication | Proceedings - International SoC Design Conference 2018, ISOCC 2018 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 15-16 |
| Number of pages | 2 |
| ISBN (Electronic) | 9781538679609 |
| DOIs | |
| Publication status | Published - 2019 Feb 22 |
| Event | 15th International SoC Design Conference, ISOCC 2018 - Daegu, Korea, Republic of Duration: 2018 Nov 12 → 2018 Nov 15 |
Publication series
| Name | Proceedings - International SoC Design Conference 2018, ISOCC 2018 |
|---|
Conference
| Conference | 15th International SoC Design Conference, ISOCC 2018 |
|---|---|
| Country | Korea, Republic of |
| City | Daegu |
| Period | 18-11-12 → 18-11-15 |
All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
Fingerprint Dive into the research topics of 'Fast Steady-State Thermal Analysis'. Together they form a unique fingerprint.
Cite this
Chiou, L. Y., Chang, C. H., Lu, L. Y., Yang, W. H., Chang, Y. J., & Lu, J. M. (2019). Fast Steady-State Thermal Analysis. In Proceedings - International SoC Design Conference 2018, ISOCC 2018 (pp. 15-16). [8649912] (Proceedings - International SoC Design Conference 2018, ISOCC 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISOCC.2018.8649912