Abstract
Thermal issues are gaining critical in system-on-a-chip. We propose a two-stage thermal analysis approach using big and little matrix operations with a matrix compression method in general successive over-relaxation (SOR) to speed up the analysis of a steady-state thermal profile, referred to as TSA. Experimental results show that the analysis performance of TSA is faster than the general SOR by 2145× in average and faster than the popular Supernodal LU (SuperLU) at least by 1.55× for large size of sparse matrices.
| Original language | English |
|---|---|
| Title of host publication | Proceedings - International SoC Design Conference 2018, ISOCC 2018 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 15-16 |
| Number of pages | 2 |
| ISBN (Electronic) | 9781538679609 |
| DOIs | |
| Publication status | Published - 2019 Feb 22 |
| Event | 15th International SoC Design Conference, ISOCC 2018 - Daegu, Korea, Republic of Duration: 2018 Nov 12 → 2018 Nov 15 |
Publication series
| Name | Proceedings - International SoC Design Conference 2018, ISOCC 2018 |
|---|
Conference
| Conference | 15th International SoC Design Conference, ISOCC 2018 |
|---|---|
| Country | Korea, Republic of |
| City | Daegu |
| Period | 18-11-12 → 18-11-15 |
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All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
Cite this
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Fast Steady-State Thermal Analysis. / Chiou, Lih-Yih; Chang, Chun Hao; Lu, Liang Ying; Yang, Wei Hsuan; Chang, Yeong Jar; Lu, Juin Ming.
Proceedings - International SoC Design Conference 2018, ISOCC 2018. Institute of Electrical and Electronics Engineers Inc., 2019. p. 15-16 8649912 (Proceedings - International SoC Design Conference 2018, ISOCC 2018).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Fast Steady-State Thermal Analysis
AU - Chiou, Lih-Yih
AU - Chang, Chun Hao
AU - Lu, Liang Ying
AU - Yang, Wei Hsuan
AU - Chang, Yeong Jar
AU - Lu, Juin Ming
PY - 2019/2/22
Y1 - 2019/2/22
N2 - Thermal issues are gaining critical in system-on-a-chip. We propose a two-stage thermal analysis approach using big and little matrix operations with a matrix compression method in general successive over-relaxation (SOR) to speed up the analysis of a steady-state thermal profile, referred to as TSA. Experimental results show that the analysis performance of TSA is faster than the general SOR by 2145× in average and faster than the popular Supernodal LU (SuperLU) at least by 1.55× for large size of sparse matrices.
AB - Thermal issues are gaining critical in system-on-a-chip. We propose a two-stage thermal analysis approach using big and little matrix operations with a matrix compression method in general successive over-relaxation (SOR) to speed up the analysis of a steady-state thermal profile, referred to as TSA. Experimental results show that the analysis performance of TSA is faster than the general SOR by 2145× in average and faster than the popular Supernodal LU (SuperLU) at least by 1.55× for large size of sparse matrices.
UR - http://www.scopus.com/inward/record.url?scp=85063188221&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85063188221&partnerID=8YFLogxK
U2 - 10.1109/ISOCC.2018.8649912
DO - 10.1109/ISOCC.2018.8649912
M3 - Conference contribution
AN - SCOPUS:85063188221
T3 - Proceedings - International SoC Design Conference 2018, ISOCC 2018
SP - 15
EP - 16
BT - Proceedings - International SoC Design Conference 2018, ISOCC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
ER -