Due to the huge cost of the time and resource for thermal cyclic testing, the traditional experiment is commonly replaced by numerical simulation. In this paper, the fatigue life of the Thin Fin-pitch Ball Grid Array (TFBGA) subjected to thermal cyclic loading is analyzed. Firstly, the finite element analysis software ANSYS is used to build the 3D analysis model. Next, the relative thermal cyclic loading condition and the usage boundary condition are built. And nine material parameters of the Anand model are input. Thus, the relative stress and strain can be determined. Simultaneously, according to the maximum stress, the viscoplastic strain energy of an interface thickness for the key fracture solder ball under a thermal cycle is also found and calculated. Finally, substituting the calculated viscoplastic strain energy into the model proposed by Darveaux, the fatigue life of the TFBGA can be obtained.
|Number of pages||10|
|Journal||Chung Cheng Ling Hsueh Pao/Journal of Chung Cheng Institute of Technology|
|Publication status||Published - 2013 May 1|
All Science Journal Classification (ASJC) codes
- Physics and Astronomy(all)