Fatigue response of polyimide thin film under cyclic loading

Yu Chen Chang, Tz-Cheng Chiu, Yu Ting Yang, Yi Hsiu Tseng, Xi Hong Chen, Pu Shan Huang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Fatigue characteristics of polyimide thin film strips prepared with realistic wafer-level redistribution processes were investigated experimentally. Uniaxial tensile tests were first conducted on the thin film specimens to characterize the stress-strain relationship, and to measure ultimate strength and elongation. Both strain- and stress-controlled fatigue cycling experiments were then performed. Under strain-controlled cyclic fatigue loading an obvious stress relaxation behavior was observed. The stress relaxation characteristic depends only on the applied strain range, but not on the level of the average strain. Under stress-controlled cyclic fatigue loading the polyimide thin film exhibited both viscoelastic and plastic responses, and the peak plastic strain followed a power-law increasing trend as the fatigue cycle increased. A fatigue strain evolution model was developed by statistically fitting the stress-controlled fatigue responses with a physics-based mathematical model. The fatigue response model can be applied for developing design rules for extending the polyimide based redistribution interconnect technology to the regimes of larger chip size and higher input/output densities.

Original languageEnglish
Title of host publication2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages233-236
Number of pages4
ISBN (Electronic)9781467383561
DOIs
Publication statusPublished - 2015 Dec 23
Event10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Taipei, Taiwan
Duration: 2015 Oct 212015 Oct 23

Publication series

Name2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings

Other

Other10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015
CountryTaiwan
CityTaipei
Period15-10-2115-10-23

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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