FEA of thermal warpage in ball grid array with consideration of molding compound residual strain compared to experimental measurements

Nino Rigo Emil Lim, Richard Dimagiba, Aristotle Ubando, Jeremias Gonzaga, Gerardo Augusto

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Fingerprint

Dive into the research topics of 'FEA of thermal warpage in ball grid array with consideration of molding compound residual strain compared to experimental measurements'. Together they form a unique fingerprint.

Engineering & Materials Science

Social Sciences