具多重反應值製程之要因分析-以電路板塑料方型扁平式封裝為例

Translated title of the contribution: Finding the Key Factors for the Multiple-Response Manufacturing Process-Using a Solder Paste Stencil Printing Process as an Example

Jeh-Nan Pan, Chen Ji-Ja

Research output: Contribution to journalArticle

Original languageChinese
Pages (from-to)435-455
JournalJournal of Quality
Volume14
Issue number4
Publication statusPublished - 2007 Dec 1

Cite this

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title = "具多重反應值製程之要因分析-以電路板塑料方型扁平式封裝為例",
author = "Jeh-Nan Pan and Chen Ji-Ja",
year = "2007",
month = "12",
day = "1",
language = "Chinese",
volume = "14",
pages = "435--455",
journal = "Journal of Quality",
issn = "1022-0690",
publisher = "Chinese Society for Quality",
number = "4",

}

具多重反應值製程之要因分析-以電路板塑料方型扁平式封裝為例. / Pan, Jeh-Nan; Ji-Ja, Chen.

In: Journal of Quality, Vol. 14, No. 4, 01.12.2007, p. 435-455.

Research output: Contribution to journalArticle

TY - JOUR

T1 - 具多重反應值製程之要因分析-以電路板塑料方型扁平式封裝為例

AU - Pan, Jeh-Nan

AU - Ji-Ja, Chen

PY - 2007/12/1

Y1 - 2007/12/1

M3 - Article

VL - 14

SP - 435

EP - 455

JO - Journal of Quality

JF - Journal of Quality

SN - 1022-0690

IS - 4

ER -