Finite-element analysis of the mechanical behavior of Au/Cu and Cu/Au multilayers on silicon substrate under nanoindentation

Tong Hong Wang, Te Hua Fang, Yu-Cheng Lin

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

Finite-element analysis of the nanoindentation into Au/Cu and Cu/Au multilayers was performed to deduce their mechanical characteristics from nanoindentation response. Different bilayer thicknesses, numbers, and sequences were studied using the load-displacement curve, hardness, indentation, and the residual surface profile as well as the von Mises equivalent stress. The characteristics of the multilayers were found to be dispersed between the Au and Cu. Nevertheless, if the indentation depth is smaller than the uppermost individual layer thickness of the multilayers, the intrinsic properties can be obtained. Using the von Mises equivalent stress as a failure criterion, the results showed that thinner multilayers would induce a greater potential of shear banding deformation.

Original languageEnglish
Pages (from-to)457-463
Number of pages7
JournalApplied Physics A: Materials Science and Processing
Volume90
Issue number3
DOIs
Publication statusPublished - 2008 Mar 1

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Materials Science(all)

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