Finite element method simulation of photoinductive imaging for cracks

C. C. Tai; Y. L. Pan

doi:10.2528/PIERL07122807

Finite element method simulation of photoinductive imaging for cracks

C. C. Tai, Y. L. Pan

Department of Electrical Engineering

Research output: Contribution to journal › Article › peer-review

9 Citations (Scopus)

Abstract

In this paper, the numerical simulations of photoinductive imaging (PI) method have been performed using the finite element method (FEM) with the 2D transient to characterize corner cracks at the edge of a bolt hole. The PI imaging results have higher spatial resolution in the area of the defect in 2D models as compared with the conventional eddy current (EC) images. The FEM simulation results of 0.5-mm rectangular defects are showed and analyzed. The dependencies of PI signals on EC frequencies and temperature of the thermal spot are also examined. The results demonstrate that the PI method is applicable to examine the geometric shape of corner cracks.

Original language	English
Pages (from-to)	53-61
Number of pages	9
Journal	Progress in Electromagnetics Research Letters
Volume	2
DOIs	https://doi.org/10.2528/PIERL07122807
Publication status	Published - 2008

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials

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10.2528/PIERL07122807

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title = "Finite element method simulation of photoinductive imaging for cracks",

abstract = "In this paper, the numerical simulations of photoinductive imaging (PI) method have been performed using the finite element method (FEM) with the 2D transient to characterize corner cracks at the edge of a bolt hole. The PI imaging results have higher spatial resolution in the area of the defect in 2D models as compared with the conventional eddy current (EC) images. The FEM simulation results of 0.5-mm rectangular defects are showed and analyzed. The dependencies of PI signals on EC frequencies and temperature of the thermal spot are also examined. The results demonstrate that the PI method is applicable to examine the geometric shape of corner cracks.",

author = "Tai, {C. C.} and Pan, {Y. L.}",

note = "Funding Information: This research was supported by the grant from National Science Council, Taiwan (NSC 96-2628-E-006-256-MY3). Also, this work made use of Shared Facilities supported by the Program of Top 100 Universities Advancement, Ministry of Education, Taiwan. Publisher Copyright: {\textcopyright} 2016, Electromagnetics Academy. All rights reserved.",

year = "2008",

doi = "10.2528/PIERL07122807",

language = "English",

volume = "2",

pages = "53--61",

journal = "Progress in Electromagnetics Research Letters",

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TY - JOUR

T1 - Finite element method simulation of photoinductive imaging for cracks

AU - Tai, C. C.

AU - Pan, Y. L.

N1 - Funding Information: This research was supported by the grant from National Science Council, Taiwan (NSC 96-2628-E-006-256-MY3). Also, this work made use of Shared Facilities supported by the Program of Top 100 Universities Advancement, Ministry of Education, Taiwan. Publisher Copyright: © 2016, Electromagnetics Academy. All rights reserved.

PY - 2008

Y1 - 2008

N2 - In this paper, the numerical simulations of photoinductive imaging (PI) method have been performed using the finite element method (FEM) with the 2D transient to characterize corner cracks at the edge of a bolt hole. The PI imaging results have higher spatial resolution in the area of the defect in 2D models as compared with the conventional eddy current (EC) images. The FEM simulation results of 0.5-mm rectangular defects are showed and analyzed. The dependencies of PI signals on EC frequencies and temperature of the thermal spot are also examined. The results demonstrate that the PI method is applicable to examine the geometric shape of corner cracks.

AB - In this paper, the numerical simulations of photoinductive imaging (PI) method have been performed using the finite element method (FEM) with the 2D transient to characterize corner cracks at the edge of a bolt hole. The PI imaging results have higher spatial resolution in the area of the defect in 2D models as compared with the conventional eddy current (EC) images. The FEM simulation results of 0.5-mm rectangular defects are showed and analyzed. The dependencies of PI signals on EC frequencies and temperature of the thermal spot are also examined. The results demonstrate that the PI method is applicable to examine the geometric shape of corner cracks.

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JO - Progress in Electromagnetics Research Letters

JF - Progress in Electromagnetics Research Letters

ER -

Finite element method simulation of photoinductive imaging for cracks

Abstract

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