Finite element method simulation of photoinductive imaging for cracks

Cheng-Chi Tai, Yen Lin Pan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

In this paper, the numerical simulations of photoinductive imaging (PI) method have been performed using the finite element method (FEM) with the 2D transient to characterize corner cracks at the edge of a bolt hole. The PI imaging results have higher spatial resolution in the area of the defect in 2D models as compared with the conventional eddy current (EC) images. The FEM simulation results of 0.5-mm rectangular defects are showed and analyzed. The dependencies of PI signals on EC frequencies and temperature of the thermal spot are also examined. The results demonstrate that the PI method is applicable to examine the geometric shape of corner cracks.

Original languageEnglish
Title of host publicationProgress in Electromagnetics Research Symposium 2008, PIERS 2008 Hangzhou
PublisherElectromagnetics Academy
Pages1220-1224
Number of pages5
ISBN (Print)9781618390530
Publication statusPublished - 2008 Jan 1
EventProgress in Electromagnetics Research Symposium 2008, PIERS 2008 Hangzhou - Hangzhou, China
Duration: 2008 Mar 242008 Mar 28

Publication series

NameProgress in Electromagnetics Research Symposium
Volume2
ISSN (Print)1559-9450

Other

OtherProgress in Electromagnetics Research Symposium 2008, PIERS 2008 Hangzhou
CountryChina
CityHangzhou
Period08-03-2408-03-28

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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