FIXED-OUTLINE FLOORPLANNING APPROACH FOR MIXED-SIZE MODULES

Jai-Ming Lin (Inventor)

Research output: Patent

Abstract

A fixed-outline floorplanning approach for mixed-size modules is disclosed. Firstly, evenly distribute mixed-size circuit modules to whole chip area based on different requirements such as wire-length, routability, or thermal in the global distribution stage. To maintain the global distribution result and satisfy the fixed-outline constraint, generate a slicing tree by recursively applying partition algorithm to divide modules distributed in a given region into several sub-regions. Then, to remove overlap between circuit modules and find a best solution, use bottom-up shape curve merging and top-down back tracing procedure to generate a slicing tree. The shape curve for each leaf in the tree is built first by enumerated packing. Then, the curves in the tree are merged iteratively from bottom to top,
Translated title of the contributionFIXED-OUTLINE FLOORPLANNING APPROACH FOR MIXED-SIZE MODULES
Original languageEnglish
Patent number8966428
Publication statusPublished - 2015 Jan 8

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