Flame-retarding materials, 3: Tailor-made thermal stability epoxy curing agents containing difunctional phosphoric amide groups

Ping Lin Kuo, Ja Shung Wang, Po Chuan Chen, Leo Wang Chen

Research output: Contribution to journalArticlepeer-review

17 Citations (Scopus)

Abstract

Four different phosphoric amides, p-phenylphosphonic diamide (2-NH2-PH), phenylphosphonicbis(N-butylamide) (2-BU-PH), phenylphosphorobis(N-butylamide) (2-BU-PHO) and phenylphosphonicbis(N-benzylamide) (2-BZ-PH), have been successfully synthesized by low temperature condensation and characterized by FT-IR. 1H NMR and 31P NMR. These phosphoric amides have been used to cure commercially available, unmodified, liquid epoxy resins. The curing behaviors and thermal stability of the cured films have been studied. Comparing the curing temperatures (initial (Ti), peak (Tp), and final (Tf)) and the degree of curing, it has been observed that using the curing agent containing bulky groups i.e., more sterically hindered structure, results in higher curing temperatures but a lower degree of curing. When comparing 2-BU-PHO, which contains a phenoxy group, with 2-BU-PH containing a phenyl group in the back bone, it is interesting to note that the phosphorus content in 2-BU-PHO is lower (4.81%) than that of 2-BU-PH (4.93%), but the residual weight percent at 800°C (R800) and also the temperature needed to obtain 10% weight loss (T0.1) is significantly higher for 2-BU-PHO cured epoxies. Also the results from 2-BZ-PH, which unlike 2-BU-PH contains aromatic benzyl groups, indicate that the aromaticity of the curing agent does not affect the thermal stability of the cured polymer film.

Original languageEnglish
Pages (from-to)2175-2180
Number of pages6
JournalMacromolecular Chemistry and Physics
Volume202
Issue number11
DOIs
Publication statusPublished - 2001 Aug 4

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Physical and Theoretical Chemistry
  • Organic Chemistry
  • Polymers and Plastics
  • Materials Chemistry

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