Forced diffusion via electrically induced crystallization for fabricating ZnO-Ti-Si structures

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Abstract

Electrically induced crystallization (EIC) is a recently developed process for material modification. This study is applied to EIC to fabricate ZnO-Ti-Si multi-layer structures of various thicknesses to dope Ti into ZnO thin film and to form TiSix intermetallic compound (IMC) in a single step. The IMC layer was confirmed using transmission electron microscopy images. The Ti layer thickness was more than 40 nm, which enhanced electron transmission and decreased the total electrical resistance in the structure. Finally, the diffusion mechanisms of EIC and the annealing process were investigated. This study shows that the EIC process has potential for industrial applications.

Original languageEnglish
Pages (from-to)425-430
Number of pages6
JournalMaterials Research Bulletin
Volume59
DOIs
Publication statusPublished - 2014 Jan 1

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

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