Foreword

Cheng Wen Wu, Kuen Jong Lee, Li C. Wang, Shi Yu Huang

Research output: Contribution to journal › Editorial

Original languageEnglish
Article number8097094
Pages (from-to)iv
JournalITC-Asia 2017 - International Test Conference in Asia
DOIs
Publication statusPublished - 2017 Nov 3
Event1st International Test Conference in Asia, ITC-Asia 2017 - Taipei, Taiwan
Duration: 2017 Sep 13 → 2017 Sep 15

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Automotive Engineering
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

Cite this

Wu, Cheng Wen ; Lee, Kuen Jong ; Wang, Li C. ; Huang, Shi Yu. / Foreword. In: ITC-Asia 2017 - International Test Conference in Asia. 2017 ; pp. iv.
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year = "2017",
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doi = "10.1109/ITC-ASIA.2017.8097094",
language = "English",
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journal = "ITC-Asia 2017 - International Test Conference in Asia",

}

Wu, CW, Lee, KJ, Wang, LC & Huang, SY 2017, 'Foreword', ITC-Asia 2017 - International Test Conference in Asia, pp. iv. https://doi.org/10.1109/ITC-ASIA.2017.8097094

Foreword. / Wu, Cheng Wen; Lee, Kuen Jong; Wang, Li C.; Huang, Shi Yu.

In: ITC-Asia 2017 - International Test Conference in Asia, 03.11.2017, p. iv.

Research output: Contribution to journal › Editorial

TY - JOUR

T1 - Foreword

AU - Wu, Cheng Wen

AU - Lee, Kuen Jong

AU - Wang, Li C.

AU - Huang, Shi Yu

PY - 2017/11/3

Y1 - 2017/11/3

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U2 - 10.1109/ITC-ASIA.2017.8097094

DO - 10.1109/ITC-ASIA.2017.8097094

M3 - Editorial

AN - SCOPUS:85040608014

SP - iv

JO - ITC-Asia 2017 - International Test Conference in Asia

JF - ITC-Asia 2017 - International Test Conference in Asia

M1 - 8097094

ER -

Wu CW, Lee KJ, Wang LC, Huang SY. Foreword. ITC-Asia 2017 - International Test Conference in Asia. 2017 Nov 3;iv. 8097094. https://doi.org/10.1109/ITC-ASIA.2017.8097094

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