@article{f7ed9350d53444ee8228c9d1d2807f9d,
title = "Foreword: Pb-free solders and emerging interconnect and packaging technologies",
author = "Lin, {Kwang Lung} and Kang, {Sung K.} and Duh, {Jenq Gong} and Andre Lee and Thomas Bieler and Laura Turbini and Rajen Sidhu and Fu Guo and Iver Anderson",
year = "2010",
month = dec,
doi = "10.1007/s11664-010-1389-8",
language = "English",
volume = "39",
pages = "2503",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
publisher = "Springer New York",
number = "12",
}