Foreword: Pb-free solders and emerging interconnect and packaging technologies

Kwang Lung Lin; Sung K. Kang; Jenq Gong Duh; Andre Lee; Thomas Bieler; Laura Turbini; Rajen Sidhu; Fu Guo; Iver Anderson

doi:10.1007/s11664-010-1389-8

Foreword: Pb-free solders and emerging interconnect and packaging technologies

Kwang Lung Lin, Sung K. Kang, Jenq Gong Duh, Andre Lee, Thomas Bieler, Laura Turbini, Rajen Sidhu, Fu Guo, Iver Anderson

Research output: Contribution to journal › Editorial › peer-review

3 Citations (Scopus)

Original language	English
Pages (from-to)	2503
Number of pages	1
Journal	Journal of Electronic Materials
Volume	39
Issue number	12
DOIs	https://doi.org/10.1007/s11664-010-1389-8
Publication status	Published - 2010 Dec

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/s11664-010-1389-8

Cite this

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title = "Foreword: Pb-free solders and emerging interconnect and packaging technologies",

author = "Lin, {Kwang Lung} and Kang, {Sung K.} and Duh, {Jenq Gong} and Andre Lee and Thomas Bieler and Laura Turbini and Rajen Sidhu and Fu Guo and Iver Anderson",

year = "2010",

month = dec,

doi = "10.1007/s11664-010-1389-8",

language = "English",

volume = "39",

pages = "2503",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "12",

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TY - JOUR

T1 - Foreword

T2 - Pb-free solders and emerging interconnect and packaging technologies

AU - Lin, Kwang Lung

AU - Kang, Sung K.

AU - Duh, Jenq Gong

AU - Lee, Andre

AU - Bieler, Thomas

AU - Turbini, Laura

AU - Sidhu, Rajen

AU - Guo, Fu

AU - Anderson, Iver

PY - 2010/12

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U2 - 10.1007/s11664-010-1389-8

DO - 10.1007/s11664-010-1389-8

M3 - Editorial

AN - SCOPUS:78049505312

VL - 39

SP - 2503

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 12

ER -

Foreword: Pb-free solders and emerging interconnect and packaging technologies

All Science Journal Classification (ASJC) codes

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