Foreword: Pb-free solders and emerging interconnect and packaging technologies

Kwang-Lung Lin, Sung K. Kang, Jenq Gong Duh, Andre Lee, Thomas Bieler, Laura Turbini, Rajen Sidhu, Fu Guo, Iver Anderson

Research output: Contribution to journalEditorial

3 Citations (Scopus)
Original languageEnglish
Number of pages1
JournalJournal of Electronic Materials
Volume39
Issue number12
DOIs
Publication statusPublished - 2010 Dec 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

Lin, Kwang-Lung ; Kang, Sung K. ; Duh, Jenq Gong ; Lee, Andre ; Bieler, Thomas ; Turbini, Laura ; Sidhu, Rajen ; Guo, Fu ; Anderson, Iver. / Foreword : Pb-free solders and emerging interconnect and packaging technologies. In: Journal of Electronic Materials. 2010 ; Vol. 39, No. 12.
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Lin, K-L, Kang, SK, Duh, JG, Lee, A, Bieler, T, Turbini, L, Sidhu, R, Guo, F & Anderson, I 2010, 'Foreword: Pb-free solders and emerging interconnect and packaging technologies', Journal of Electronic Materials, vol. 39, no. 12. https://doi.org/10.1007/s11664-010-1389-8

Foreword : Pb-free solders and emerging interconnect and packaging technologies. / Lin, Kwang-Lung; Kang, Sung K.; Duh, Jenq Gong; Lee, Andre; Bieler, Thomas; Turbini, Laura; Sidhu, Rajen; Guo, Fu; Anderson, Iver.

In: Journal of Electronic Materials, Vol. 39, No. 12, 01.12.2010.

Research output: Contribution to journalEditorial

TY - JOUR

T1 - Foreword

T2 - Pb-free solders and emerging interconnect and packaging technologies

AU - Lin, Kwang-Lung

AU - Kang, Sung K.

AU - Duh, Jenq Gong

AU - Lee, Andre

AU - Bieler, Thomas

AU - Turbini, Laura

AU - Sidhu, Rajen

AU - Guo, Fu

AU - Anderson, Iver

PY - 2010/12/1

Y1 - 2010/12/1

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U2 - 10.1007/s11664-010-1389-8

DO - 10.1007/s11664-010-1389-8

M3 - Editorial

AN - SCOPUS:78049505312

VL - 39

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 12

ER -