Foreword: Pb-free solders and emerging interconnect and packaging technologies

Kwang Lung Lin, Sung K. Kang, Jenq Gong Duh, Andre Lee, Thomas Bieler, Laura Turbini, Rajen Sidhu, Fu Guo, Iver Anderson

Research output: Contribution to journalEditorialpeer-review

3 Citations (Scopus)
Original languageEnglish
Pages (from-to)2503
Number of pages1
JournalJournal of Electronic Materials
Volume39
Issue number12
DOIs
Publication statusPublished - 2010 Dec

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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