Skip to main navigation
Skip to search
Skip to main content
National Cheng Kung University Home
English
中文
Home
Profiles
Research Units
Research output
Projects
Student theses
Equipment
Activities
Search by expertise, name or affiliation
Fundamentals of Solder Alloys in 3D Packaging
Kwang Lung Lin
Department of Materials Science and Engineering
International Curriculum for Advanced Materials Program
Research output
:
Chapter in Book/Report/Conference proceeding
›
Chapter
Overview
Fingerprint
Fingerprint
Dive into the research topics of 'Fundamentals of Solder Alloys in 3D Packaging'. Together they form a unique fingerprint.
Sort by
Weight
Alphabetically
Engineering & Materials Science
Chemical analysis
9%
Hot Temperature
14%
Intermetallics
30%
Metallizing
16%
Microelectronics
15%
Microstructure
9%
Monitoring
8%
Networks (circuits)
16%
Packaging
92%
Soldering alloys
100%
Substrates
20%
Volume fraction
13%