Ga-based submicron particle and applications

Hseng Ming Liao, Che Yu Yeh, Shih Kang Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In our previous work, a novel transient liquid phase bonding (TLP bonding) process for Cu-To-Cu interconnection has been proposed. By using Ga as the bonding material as interconnect material for Ni/Cu substrates. A thermal stable solid solution bonding interface without intermetallic compounds can be formed. Compare to Ga (m.p. 29.7°C), Ga-In-Sn alloy, (m.p. 10.7°C) is another candidate for this novel Cu-To-Cu bonding material. Sonochemistry is applied to Ga-In-Sn alloy to synthesis particles. Ga-In-Sn particles around submicron level with oxide shell is characterized and the particle size is altered with organic solvent used in process, some of Sn phase are found to segregate into Sn nanoparticle.

Original languageEnglish
Title of host publication2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages396-398
Number of pages3
ISBN (Electronic)9784990218850
DOIs
Publication statusPublished - 2018 Jun 6
Event2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 - Kuwana, Mie, Japan
Duration: 2018 Apr 172018 Apr 21

Publication series

Name2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018

Other

Other2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
CountryJapan
CityKuwana, Mie
Period18-04-1718-04-21

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Polymers and Plastics

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