Abstract
Speed and power performances of Si-based stacked-nanowire gate-all-around (GAA) FETs and pragmatic ultra-thin-fin FETs at the 5nm CMOS technology node are projected, compared, and physically explained based on 3-D numerical simulations. The respective device domains are also used to compare integration densities based on 6T-SRAM layouts. Predicted comparable performances and densities, with considerations of the complexity/cost of GAAFET processing versus that of the FinFET with pragmatic simplifications, suggest that the FinFET is the better choice for the future.
Original language | English |
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Article number | 7890390 |
Pages (from-to) | 164-169 |
Number of pages | 6 |
Journal | IEEE Journal of the Electron Devices Society |
Volume | 5 |
Issue number | 3 |
DOIs | |
Publication status | Published - 2017 May |
All Science Journal Classification (ASJC) codes
- Biotechnology
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering